Effect of Ge Metal--Insulator--Semiconductor Interfacial Layers on Interface Trap Density near the Conduction Band Edge

The interface structures and electrical interface properties near the conduction band edge (CBE) of Ge metal--insulator--semiconductor (MIS) capacitors with Si or GeO 2 interfacial layers (ILs) were systematically investigated using physical analysis and the Gray--Brown (GB) method. The accuracy of...

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Bibliographic Details
Published inJapanese Journal of Applied Physics Vol. 49; no. 4; pp. 04DA09 - 04DA09-6
Main Authors Taoka, Noriyuki, Mizubayashi, Wataru, Morita, Yukinori, Migita, Shinji, Ota, Hiroyuki, Takagi, Shinichi
Format Journal Article
LanguageEnglish
Published The Japan Society of Applied Physics 01.04.2010
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Summary:The interface structures and electrical interface properties near the conduction band edge (CBE) of Ge metal--insulator--semiconductor (MIS) capacitors with Si or GeO 2 interfacial layers (ILs) were systematically investigated using physical analysis and the Gray--Brown (GB) method. The accuracy of the values of interface trap density ($D_{\text{it}}$) obtained by the GB method was confirmed by comparing these with the values obtained by the conductance method. The GB method revealed that Ge MIS capacitors with a Si IL have a large number of interface traps near the CBE, and that the dislocations introduced at a Si IL/Ge interface have an insignificant effect on $D_{\text{it}}$ near CBE. On the other hand, the $D_{\text{it}}$ of the GeO 2 IL capacitors was lower by almost one order of magnitude than that of the Si IL capacitors. In addition, the $D_{\text{it}}$ of the GeO 2 IL/Ge interface was also reduced by high-temperature oxidation during post metallization annealing. These results indicate that ILs have a strong influence on $D_{\text{it}}$ near the CBE, and that the GeO 2 IL and high-temperature oxidation are quite effective in reducing $D_{\text{it}}$ near the CBE.
ISSN:0021-4922
1347-4065
DOI:10.1143/JJAP.49.04DA09