Dielectric analysis as a cure monitoring system for UF particle boards

To achieve good quality wood composites, the degree of curing of the adhesive – often an aminoplastic thermosetting resin – is an important factor. Dielectric analysis (DEA) is an established method for characterizing the curing behaviour of coatings. This method is also promising for the online-mon...

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Bibliographic Details
Published inInternational journal of adhesion and adhesives Vol. 73; pp. 45 - 50
Main Authors Müller, Uwe, Pretschuh, Claudia, Mitter, Roland, Knappe, Stephan
Format Journal Article
LanguageEnglish
Published Kidlington Elsevier Ltd 01.03.2017
Elsevier BV
Subjects
Adhesives
Aldehydes
Boards
Crosslinking
Cure monitoring
Curing
Curing/hardening
Dielectric cure monitoring
Dielectric properties
Dielectric spectroscopy
Dielectrics
Formaldehyde
Non-destructive testing
Particulate composites
Polymer matrix composites
Pressing
Tensile strength
Thermal analysis
Thermosetting resins
Viscosity
Wood adhesives
Wood and wood composites
Wood composites
Dielectric spectroscopy
Non-destructive testing
Curing/hardening
Wood adhesives
Wood and wood composites
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Summary:To achieve good quality wood composites, the degree of curing of the adhesive – often an aminoplastic thermosetting resin – is an important factor. Dielectric analysis (DEA) is an established method for characterizing the curing behaviour of coatings. This method is also promising for the online-monitoring of the curing of aminoplastic thermoset resins. By DEA, changes in the curing behaviour as a result of processing conditions (of the composite) can be immediately observed during the production; furthermore DEA enables control and optimisation of the production time. In the present work, DEA cure monitoring was tested in pilot plant scale production of urea-formaldehyde (UF) based particle boards. The measurements were performed during hot-pressing; the pressing times and binder types were varied. The degree of curing was calculated from logarithmic ion viscosity values. Sufficient cross-linking resulted in a significant increase of the ion viscosity. The logarithmic ion viscosity values which are measured at the end of the pressing process were correlated with the transverse tensile strength of the obtained particle boards.
ISSN:0143-7496
1879-0127
DOI:10.1016/j.ijadhadh.2016.07.016