The origin of stresses in magnetron-sputtered thin films with zone T structures

• Published in: Acta materialia Vol. 58; no. 7; pp. 2621 - 2633
• Main Authors: Daniel, R., Martinschitz, K.J., Keckes, J., Mitterer, C.
• Format: Journal Article
• Language: English
• Published: Kidlington Elsevier Ltd 01.04.2010; Elsevier
• Subjects: Applied sciences; CrN; Cross-disciplinary physics: materials science; rheology; Exact sciences and technology; Film growth; Materials science; Metals. Metallurgy; Methods of deposition of films and coatings; film growth and epitaxy; Physics; Production techniques; Residual stress; Structure; Surface treatment; Structure; CrN; Residual stress; Cr; Film growth; Magnetron; Sputtering; Surface treatment; Thin film
• ISSN: 1359-6454; 1873-2453
• DOI: 10.1016/j.actamat.2009.12.048

In order to understand the origin of the residual stress state in thin films and its thickness dependence, the structure–stress relation of magnetron-sputtered Cr and CrN layers with thicknesses ranging from 100 nm to 3 μm was investigated in detail. Based on correlations between the layer-thickness-dependent grain size, texture and morphology and the magnitude of the intrinsic and thermal components of the residual stress, a model is proposed that explains the origin of internal stresses of thin polycrystalline films with zone T structures. The model was further extended for the CrN/Cr dual-layer system, where the CrN top layer is epitaxially aligned with the underlying highly (2 0 0)-oriented Cr interlayer. It is shown for the first time that both the intrinsic and thermal stress components are thickness-dependent, which is associated with the layer microstructure.