XPS method as a useful tool for studies of quantum well epitaxial materials: Chemical composition and thermal stability of InGaN/GaN multilayers

•The InGaN multi quantum wells (MQWs) were investigated using the XPS technique.•Both the InGaN QWs and GaN barriers parameters were well characterized.•The interdiffusion of In within the GaN barriers induced by annealing was detected.•The XPS depth profiling analysis is useful to optimize the grow...

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Published inJournal of alloys and compounds Vol. 597; pp. 181 - 187
Main Authors Lisowski, Wojciech, Grzanka, Ewa, Sobczak, Janusz W., Krawczyk, Mirosław, Jablonski, Aleksander, Czernecki, Robert, Leszczyński, Michał, Suski, Tadeusz
Format Journal Article
LanguageEnglish
Published Kidlington Elsevier B.V 05.06.2014
Elsevier
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Summary:•The InGaN multi quantum wells (MQWs) were investigated using the XPS technique.•Both the InGaN QWs and GaN barriers parameters were well characterized.•The interdiffusion of In within the GaN barriers induced by annealing was detected.•The XPS depth profiling analysis is useful to optimize the growth of InGaN/GaN MQWs. The XPS technique combined with low energy Ar+ ion sputter depth profiling was used to obtain information about chemical composition and reproducibility of the growth procedure by the MOVPE method of the InGaN multi quantum wells (MQWs). A good in-depth resolution of the XPS depth profiling technique, allows observation of InGaN quantum wells with thickness down to 2nm. However quantitative characterization of very narrow QWs is limited by the elemental detection range of the XPS analysis. Both the InGaN QWs and GaN barriers parameters were well characterized using the model MQWs samples with various QW thickness. Inter-diffusion of indium within the GaN barrier layers, induced by high-temperature annealing, has been detected. This work evidences the successful application of the XPS depth profiling analysis as a very useful tool to optimize the growth parameters and thermal stability of InGaN/GaN MQWs.
ISSN:0925-8388
1873-4669
DOI:10.1016/j.jallcom.2014.02.007