Plasma surface treatment of Cu by nanosecond-pulse diffuse discharges in atmospheric air

• Published in: Plasma science & technology Vol. 20; no. 1; pp. 74 - 81
• Main Authors: ZHANG, Cheng, QIU, Jintao, KONG, Fei, HOU, Xingmin, FANG, Zhi, YIN, Yu, SHAO, Tao
• Format: Journal Article
• Language: English
• Published: IOP Publishing 01.01.2018
• Subjects: copper; diffuse discharge; microhardness; nanosecond pulse; surface treatment; water contact angle
• ISSN: 1009-0630; 1009-0630
• DOI: 10.1088/2058-6272/aa8c6e

Nanosecond-pulse diffuse discharges could provide high-density plasma and high-energy electrons at atmospheric pressure. In this paper, the surface treatment of Cu by nanosecond-pulse diffuse discharges is conducted in atmospheric air. Factors influencing the water contact angle （WCA）, chemical composition and microhardness, such as the gap spacing and treatment time, are investigated. The results show that after the plasma surface treatment, the WCA considerably decreases from 87~ to 42.3~, and the surface energy increases from 20.46 mJ m-2 to 66.28 mJ m-2. Results of energy dispersive x-ray analysis show that the concentration of carbon decreases, but the concentrations of oxygen and nitrogen increase significantly. Moreover, the microhardness increases by approximately 30% after the plasma treatment. The aforementioned changes on the Cu surface indicate the plasma surface treatment enhances the hydrophilicity and microhardness, and it cleans the carbon and achieves oxidization on the Cu surface. Furthermore, by increasing the gap spacing and treatment time, better treatment effects can be obtained. The micmhardness in the case of a 2.5 cm gap is higher than that in the case of a 3 cm gap. More oxygen and nitrogen species appear on the Cu surface for the 2.5 cm gap treatment than for the 3 cm gap treatment. The WCA significantly decreases with the treatment thne when it is no longer than 90 s, and then it reaches saturation. In addition, more oxygen-containing and nitrogen-containing groups appear after extended plasma treatment time. They contribute to the improvement of the hydrophilicity and oxidation on the Cu surface.