Packaging of an Amplifier Module for Sub-THz Wireless Transmission Based on Photonics

In this study, we have developed an amplifier waveguide module suitable for broadband communication in the sub-THz band. To achieve a waveguide module with excellent gain flatness characteristics, the effects of errors during the packaging procedures of the waveguide module and the space occupied by...

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Published inJournal of Electromagnetic Engineering and Science Vol. 23; no. 6; pp. 470 - 481
Main Authors Kim, Sooyeon, Choi, Chan-Gyu, Moon, Sang-Rok, Sung, Minkyu, Kim, Eon-sang, Song, Ho-Jin, Jeong, Hyunhak, Kim, Seung Hwan, Cho, Seung-Hyun
Format Journal Article
LanguageEnglish
Published 한국전자파학회JEES 01.11.2023
The Korean Institute of Electromagnetic Engineering and Science
Subjects
amplifier
packaging
sub-thz
waveguide module
Packaging
Waveguide Module
Amplifier
Sub-THz
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Summary:In this study, we have developed an amplifier waveguide module suitable for broadband communication in the sub-THz band. To achieve a waveguide module with excellent gain flatness characteristics, the effects of errors during the packaging procedures of the waveguide module and the space occupied by the bondwire were analyzed through an electromagnetic simulation. Furthermore, a photonics-based sub-THz wireless link with a carrier frequency of 288 GHz was established using a packaged amplifier module. The amplifier module was placed at the output of the sub-THz transmitter based on a uni-traveling-carrier photodiode and at the input of the sub-THz receiver. The maximum gain and 3 dB bandwidth of the amplifier module are 17.3 dB and 39 GHz, respectively. With this setup, we successfully transmitted a 100-Gbps 16-QAM modulated signal, employing a carrier frequency of 288 GHz, across a wireless distance of 100 m.
ISSN:2671-7255
2671-7263
DOI:10.26866/jees.2023.6.r.192