Optoelectronic multichip module integration for chip level optical interconnects

• Published in: IEEE photonics technology letters Vol. 13; no. 10; pp. 1112 - 1114
• Main Authors: Prather, D.W., Venkataraman, S., Lecompte, M., Kiamilev, F., Mait, J.N., Simonis, G.J.
• Format: Journal Article
• Language: English
• Published: New York IEEE 01.10.2001; The Institute of Electrical and Electronics Engineers, Inc. (IEEE)
• Subjects: Arrays; Beams (radiation); Diffraction; Drivers; Integrated optics; Integrated optoelectronics; Laser beams; Lenses; Multichip modules; Optical arrays; Optical device fabrication; Optical diffraction; Optoelectronics; Surface emitting lasers; Systems design; Vertical cavity surface emission lasers; Vertical cavity surface emitting lasers
• ISSN: 1041-1135; 1941-0174
• DOI: 10.1109/68.950752

We have integrated an 850-nm vertical-cavity surface-emitting laser (VCSEL), its driver, and a diffractive lenslet array onto a single substrate to produce an integrated optoelectronic multichip module for signal fan-out and distribution. The diffractive element performs optical fan-out of the output beam from the VCSEL into an array of focused spots at a plane 1, 416 μm from the surface of the VCSEL. This corresponds to 160 μm from the surface of the diffractive lens. System design, fabrication, integration, and experimental characterization is presented.