Effect of annealing temperature on electrical and thermal property of cold-rolled multi-walled carbon nanotubes reinforced copper composites

• Published in: Diamond and related materials Vol. 108; p. 107980
• Main Authors: Van Duong, Luong, Anh, Nguyen Ngoc, Trung, Tran Bao, Chung, Le Danh, Huan, Nguyen Quang, Nhung, Do Thi, Phuong, Mai Thi, Minh, Phan Ngoc, Phuong, Doan Dinh, Van Trinh, Pham
• Format: Journal Article
• Language: English
• Published: Amsterdam Elsevier B.V 01.10.2020; Elsevier BV
• Subjects: Annealing; Carbon nanotubes (CNTs); Cold; Cold pressing; Cold rolling; Composite materials; Copper; Copper (Cu) composite; Electrical and thermal property; Electrical resistivity; Grain growth; Heat conductivity; Heat transfer; Multi wall carbon nanotubes; Recrystallization; Thermal conductivity; Thermal expansion; Thermodynamic properties; Carbon nanotubes (CNTs); Annealing; Electrical and thermal property; Copper (Cu) composite
• ISSN: 0925-9635; 1879-0062
• DOI: 10.1016/j.diamond.2020.107980

Demanding for high thermal and electrical conductive copper-based composites for structural, electrical and thermal applications are being indispensable. In this work, a method is proposed to improve the electrical and thermal conductivity of multi-walled carbon nanotubes/copper (MWCNTs/Cu) composites by applying the annealing process. The effect of annealing temperatures on the electrical and thermal properties of MWCNTs/Cu composite containing 0.5 vol% MWCNTs prepared by conventional sintering followed by cold rolling was investigated. The experimental results indicated that as increasing annealing temperature, the electrical and thermal conductivity increased due to the recovery, the recrystallization and the grain growth of the Cu matrix. The electrical and thermal conductivity of cold rolled MWCNTs/Cu composite annealed at 500 °C are improved up to 9% and 19% respectively compared to the composite without annealing. The coefficient of thermal expansion (CTE) of the MWCNTs/Cu composite is 8% lower compared to the pure Cu attributed to uniform dispersed MWCNTs, low coefficient of thermal expansion of MWCNTs, good bonding between CNTs and the matrix. [Display omitted] •Cold-rolled MWCNT/Cu composite was prepared and investigated.•The electrical and thermal properties of the composite were investigated.•Electrical and thermal conductivity increased with increasing in annealing temperatures.•The CTE of the MWCNT/Cu composite is 8% lower compared to the pure Cu.