Si film electrodes adopting a dual thermal effect of metal-induced crystallization (MIC) and Kirkendall effect

The structural and electrochemical properties of Si film electrodes with Ni/Ti films on a Cu current collector (Si electrodes) were investigated after annealing in a temperature range of 400–600 °C. Metal-induced crystallization (MIC) and Kirkendall effects were simultaneously observed in the Si ele...

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Published inJournal of alloys and compounds Vol. 809; p. 151810
Main Authors Cho, Gyu-Bong, Park, Sang-Hui, Park, Sang-Hee, Ju, Jin-Hoon, Cho, Kwon-Koo, Ahn, Hyo-Jun, Kim, Ki-Won
Format Journal Article
LanguageEnglish
Published Lausanne Elsevier B.V 15.11.2019
Elsevier BV
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Summary:The structural and electrochemical properties of Si film electrodes with Ni/Ti films on a Cu current collector (Si electrodes) were investigated after annealing in a temperature range of 400–600 °C. Metal-induced crystallization (MIC) and Kirkendall effects were simultaneously observed in the Si electrodes annealed above 450 °C for 2 h. The MIC effect led to the partial formation of strongly -oriented Si in the Si film, and the crystallinity of Si increased with increasing annealing temperature. The Kirkendall effect led to the diffusion of Cu and formed a Cu3Si layer on the surface of the Si film. The capacity of the Si electrodes decreased owing to the formation of the silicide and the efficiency was improved with increasing annealing temperature. A Si electrode annealed at 500 °C for 2 h exhibited good cycle performance with an activation region owing to the anisotropic lithiation during the initial cycles and the Cu3Si layers supporting the Si film. [Display omitted] •Annealed Si film electrodes with Ni/Ti films exhibited metal-induced crystallization and Kirkendall effects.•MIC and Kirkendall effects led to the formation of strongly -oriented Si and Cu3Si layer, respectively.•The dual thermal effect improved the initial coulombic efficiency and cycle performance of Si electrodes.
ISSN:0925-8388
1873-4669
DOI:10.1016/j.jallcom.2019.151810