Self-annealing of electrodeposited copper thin film during room temperature storage

The electrodeposition of copper on steel substrates has been used to produce a relative thick copper film. The resistivity and rigidity of the copper film are the key parameters for practical applications of the Fe/Cu composite. In this study, the electrodeposition of copper on steel substrate was p...

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Bibliographic Details
Published inMaterials letters Vol. 62; no. 10; pp. 1589 - 1591
Main Authors Dong, Wen, Zhang, Jian, Zheng, Jingwu, Sheng, Jiawei
Format Journal Article
LanguageEnglish
Published Elsevier B.V 15.04.2008
Subjects
Deposition
Electrodeposition
Grain boundaries
Mechanical properties
Grain boundaries
Mechanical properties
Electrodeposition
Deposition
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Summary:The electrodeposition of copper on steel substrates has been used to produce a relative thick copper film. The resistivity and rigidity of the copper film are the key parameters for practical applications of the Fe/Cu composite. In this study, the electrodeposition of copper on steel substrate was performed at varied cathode current densities of 2∼14 A·dm − 2 . The resistivity and rigidity of the electrodeposited copper film increased with current density, while decreased with room temperature storage time due to the increase of crystal grain size and decrease of grain boundary number.
Bibliography:ObjectType-Article-2
SourceType-Scholarly Journals-1
ObjectType-Feature-1
content type line 23
ISSN:0167-577X
1873-4979
DOI:10.1016/j.matlet.2007.09.029