Frequency bandwidth estimation of TO packaging techniques for laser modules

• Published in: Optical and quantum electronics Vol. 37; no. 10; pp. 903 - 913
• Main Authors: ZHU, N. H, WANG, Y. L, QIAN, C, PUN, E. Y. B, CHUNG, P. S
• Format: Journal Article
• Language: English
• Published: Dordrecht Springer 01.08.2005
• Subjects: Applied sciences; Electronics; Exact sciences and technology; Fundamental areas of phenomenology (including applications); Lasers; Optics; Optoelectronic devices; Physics; Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices; Semiconductor lasers; laser diodes; laser module; Semiconductor lasers; semiconductor laser; Electronic packaging; Frequency response; packaging; Experimental study; Wire; Optical modulation; Laser diodes; scattering parameter measurement; Equivalent circuits
• ISSN: 0306-8919; 1572-817X
• DOI: 10.1007/s11082-004-8307-3

Two simple methods for estimating the potential modulation bandwidth of TO packaging technique are presented. The first method is based upon the comparison of the measured frequency responses of the laser diodes and the TO laser modules, and the second is from the equivalent circuit for the test fixture, the TO header, the submount and the bonding wire. It is shown that the TO packaging techniques used in the experiments can potentially achieve a frequency bandwidth of over 10.5 GHz, and the two proposed methods give similar results.