Influence of agglomerated diamond abrasive wear on sapphire material removal behavior

Further to explore the effect of the agglomerated diamond (AD) abrasive wear on material removal behavior of sapphire in lapping, the pin-on-disk test with an AD abrasive was carried out. The classifications of AD abrasive wear, material removal behavior of sapphire, friction coefficient of sliding...

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Bibliographic Details
Published inDiamond and related materials Vol. 108; p. 107965
Main Authors Chen, Jiapeng, Zhu, Nannan, Niu, Fengli, Peng, Yanan, Su, Jianxiu, Zhu, Yongwei
Format Journal Article
LanguageEnglish
Published Amsterdam Elsevier B.V 01.10.2020
Elsevier BV
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Summary:Further to explore the effect of the agglomerated diamond (AD) abrasive wear on material removal behavior of sapphire in lapping, the pin-on-disk test with an AD abrasive was carried out. The classifications of AD abrasive wear, material removal behavior of sapphire, friction coefficient of sliding contact and removal ratio of sapphire material were thoroughly investigated. The wear behavior of the AD abrasive shows two types: attrition wear and micro-fracture. Three wear statuses of the active cutting diamond grains fixed on the AD abrasive surface, including attrition wear, worn-flat and pull-out, occur in the tests. The sapphire material is mainly removed by the AD abrasive via plastic deformation. The micro-fracture feature of the AD abrasive improves its self-sharpening ability. Therefore, the micro-cutting action of the AD abrasive on the sapphire wafer has behaved well. [Display omitted] •Three wear statuses of the active cutting diamond grains fixed on the agglomerated diamond (AD) abrasive surface include attrition wear, worn-flat and pull-out.•Material is mainly removed via plastic deformation in the case of AD abrasive wear from the viewpoints of scratches and sapphire chips.•Cutting force ratio and friction coefficient in AD abrasive wear process are more stable than those in single crystalline diamond abrasive wear process.•AD abrasive wear behavior is propitious to sapphire material removal process.
ISSN:0925-9635
1879-0062
DOI:10.1016/j.diamond.2020.107965