Crystal structure and transport properties of CuPdBiS3

The CuPdBiS3 compound was synthetized from individual elements by solid-state chemical reactions and structurally characterized by single-crystal X-ray diffraction. It crystalizes in the (Bi,Sb)CuNiS3 structure-type with the P212121 space group, unit-cell parameters a = 4.8847(8), b = 7.5885(11), c ...

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Bibliographic Details
Published inJournal of alloys and compounds Vol. 792; pp. 983 - 987
Main Authors Laufek, F., Vymazalová, A., Navrátil, J., Chareev, D.A., Plášil, J.
Format Journal Article
LanguageEnglish
Published Lausanne Elsevier B.V 05.07.2019
Elsevier BV
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Summary:The CuPdBiS3 compound was synthetized from individual elements by solid-state chemical reactions and structurally characterized by single-crystal X-ray diffraction. It crystalizes in the (Bi,Sb)CuNiS3 structure-type with the P212121 space group, unit-cell parameters a = 4.8847(8), b = 7.5885(11), c = 12.8646(10), V = 476.86(11) and Z = 4. The structure of CuPdBiS3 compound forms a three-dimensional framework composed of corner-sharing [CuS4] deformed tetrahedra and [PdS4] squares. The Bi atoms form [BiS4] pyramids and fill the channels running along the a-axis. There are no short Pd-Pd, Cu-Pd or Cu-Cu interactions (<3.4 Å). Arrhenius behaviour of the electrical conductivity was observed. Considering high free carrier concertation and very low Hall mobility, charge transport is very likely realized via thermally-activated hopping processes. Despite high values of the Seebeck coefficient and rather low thermal conductivity values, the thermoelectric figure-of-merit reaches its maximal value ZT = 0.023 at 675 K only. [Display omitted] •The CuPdBiS3 phase has been synthetized using silica glass tube technique.•The crystal structure CuPdBiS3 was solved from single crystal X-ray diffraction data.•The CuPdBiS3 phase adopts the (Bi,Sb)CuNiS3 structure-type.•Semiconducting behaviour of the CuPdBiS3 phase with the estimated band gap of 1 eV was observed.
ISSN:0925-8388
1873-4669
DOI:10.1016/j.jallcom.2019.04.120