Effect of diamond surface treatment on microstructure and thermal conductivity of diamond/W-30Cu composites prepared by microwave sintering

• Published in: Diamond and related materials Vol. 104; p. 107760
• Main Authors: Wei, Chenlong, Xu, Xian, Wei, Bangzheng, Cheng, Jigui, Chen, Pengqi
• Format: Journal Article
• Language: English
• Published: Amsterdam Elsevier B.V 01.04.2020; Elsevier BV
• Subjects: Copper; Copper plating; Densification; Diamond films; Diamonds; Electroless copper plating; Electroless plating; Heat conductivity; Heat transfer; Heat treatment; Interface; Microwave sintering; Particulate composites; Sintering; Surface treatment; Thermal conductivity; W-30Cu; Thermal conductivity; W-30Cu; Microwave sintering; Electroless plating; Interface
• ISSN: 0925-9635; 1879-0062
• DOI: 10.1016/j.diamond.2020.107760

W-30Cu composites added with different amount (0–8 wt%) of diamond were fabricated by electroless copper plating and microwave sintering. The effects of sintering condition and diamond addition on the densification and thermal conductivity of the composites were investigated. The results show that the temperature, holding time, diamond content, and diamond-metal interface state all have effects on the properties of the diamond/W-30Cu composites. The relative density of the diamond/W-30Cu composites with 4 wt% coated diamond particles reached 94.99% after sintering at 1200 °C for 30 min, and the thermal conductivity reached 239.56 W·m−1 K−1, which is 42% higher than that of uncoated diamond/W-Cu composites. [Display omitted] •Diamond was first used as the addition of W-Cu composites.•W-30Cu composite powders were prepared by electroless plating.•An interlayer was introduced between diamond and W-Cu composites.•Suitable content of diamond can improve the thermal conductivity of composites.