Novel materials for electronic device fabrication using ink-jet printing technology

• Published in: Applied surface science Vol. 256; no. 4; pp. 1019 - 1022
• Main Authors: Kumashiro, Yasushi, Nakako, Hideo, Inada, Maki, Yamamoto, Kazunori, Izumi, Akira, Ishihara, Masamichi
• Format: Journal Article Conference Proceeding
• Language: English
• Published: Amsterdam Elsevier B.V 30.11.2009; Elsevier
• Subjects: Atomic hydrogen; Condensed matter: electronic structure, electrical, magnetic, and optical properties; Deoxidization; Electron and ion emission by liquids and solids; impact phenomena; Exact sciences and technology; Impact phenomena (including electron spectra and sputtering); Ink-jet; Laser ablation; Laser-beam impact phenomena; Physics; Printed wiring boards; Atomic hydrogen; Deoxidization; Laser ablation; Printed wiring boards; Ink-jet; Hydrogen; Physical radiation effects; Metallizing; Liquid phase; Film growth; Thin films; Wires; Laser radiation; Transition elements; Tungsten; Laser ablation technique; Ink jet printing; Copper; Copper oxide
• ISSN: 0169-4332; 1873-5584
• DOI: 10.1016/j.apsusc.2009.05.134

Novel materials and a metallization technique for the printed electronics were studied. Insulator inks and conductive inks were investigated. For the conductive ink, the nano-sized copper particles were used as metallic sources. These particles were prepared from a copper complex by a laser irradiation process in the liquid phase. Nano-sized copper particles were consisted of a thin copper oxide layer and a metal copper core wrapped by the layer. The conductive ink showed good ink-jettability. In order to metallize the printed trace of the conductive ink on a substrate, the atomic hydrogen treatment was carried out. Atomic hydrogen was generated on a heated tungsten wire and carried on the substrate. The temperature of the substrate was up to 60 °C during the treatment. After the treatment, the conductivity of a copper trace was 3 μΩ cm. It was considered that printed wiring boards can be easily fabricated by employing the above materials.