Strain relaxation in thin films of Cu grown on Ni(0 0 1)

Surface X-ray diffraction and kinematical model calculations are used to determine the strain relaxation of embedded wedges with internal (1 1 1) facets formed in thin Cu films when grown on Ni(0 0 1). We show the wedges to be inhomogenously strained with a large lateral relaxation near the Cu/Ni in...

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Bibliographic Details
Published inPhysica. B, Condensed matter Vol. 248; no. 1; pp. 34 - 38
Main Authors Berg Rasmussen, Frank, Baker, Jeff, Nielsen, Mourits, Feidenhans'l, Robert, Johnson, Robert L.
Format Journal Article Conference Proceeding
LanguageEnglish
Published Amsterdam Elsevier B.V 01.06.1998
Elsevier
Subjects
Condensed matter: structure, mechanical and thermal properties
Exact sciences and technology
Mechanical and acoustical properties
Nanoclusters
Physical properties of thin films, nonelectronic
Physics
Strain relaxation
Surfaces and interfaces; thin films and whiskers (structure and nonelectronic properties)
X-ray diffraction
X-ray diffraction
Strain relaxation
Nanoclusters
Thin films
Stress relaxation
Transition elements
XRD
Copper
Experimental study
Lattice parameters
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Summary:Surface X-ray diffraction and kinematical model calculations are used to determine the strain relaxation of embedded wedges with internal (1 1 1) facets formed in thin Cu films when grown on Ni(0 0 1). We show the wedges to be inhomogenously strained with a large lateral relaxation near the Cu/Ni interface which decays rapidly away from the interface.
ISSN:0921-4526
1873-2135
DOI:10.1016/S0921-4526(98)00199-9