Packaging a piezoresistive pressure sensor to measure low absolute pressures over a wide sub-zero temperature range

• Published in: Sensors and actuators. A. Physical. Vol. 83; no. 1; pp. 142 - 149
• Main Authors: Reynolds, J.Kurth, Catling, David, Blue, Randel C, Maluf, Nadim I, Kenny, Thomas
• Format: Journal Article
• Language: English
• Published: Lausanne Elsevier B.V 22.05.2000; Elsevier Science
• Subjects: Calibration; Circuits and circuit components; Circuits ans circuit components; Die attach; Electrical and electronic components, instruments and techniques; Exact sciences and technology; General equipment and techniques; Hysteresis; Instruments, apparatus, components and techniques common to several branches of physics and astronomy; Physics; Piezoresistive; Sensors (chemical, optical, electrical, movement, gas, etc.); remote sensing; Transducers; Piezoresistive; Calibration; Die attach; Hysteresis; Pressure sensors; Piezoresistive sensor; Swaging; Packaging; Experimental study; Low temperature
• ISSN: 0924-4247; 1873-3069
• DOI: 10.1016/S0924-4247(00)00294-6

The packaging, calibration, and testing of a commercial silicon fusion bonded piezoresistive pressure sensor for a Martian deployment are described. Detail is provided on the sensor mounting and electronic instrumentation required for this environment. Flight testing procedures and the residual errors for packaged pressure sensors are presented. Pressure and temperature hysteresis are investigated as sources of this error. The data illustrates the potential high performance of off-the-shelf silicon fusion bonded piezoresistive pressure sensors, which are carefully packaged, instrumented, and individually calibrated.