High-frequency low-dielectric-loss in linear-backbone-structured polyimides with ester groups and ether bonds

Abstract Polyimides have emerged as promising dielectric materials for communication equipment, owing to their excellent thermal stability and processability. Nonetheless, a pressing need remains to reduce the high-frequency dissipation factor ( D f ) of polyimides. Here, we synthesized various poly...

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Bibliographic Details
Published inCommunications materials Vol. 5; no. 1; pp. 55 - 11
Main Authors Zhang, Chenggang, He, Xiaojie, Lu, Qinghua
Format Journal Article
LanguageEnglish
Published London Nature Publishing Group 01.12.2024
Nature Portfolio
Subjects
Chemical bonds
Communications equipment
Dielectrics
Dissipation factor
Molecular structure
Polyimide resins
Thermal stability
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Summary:Abstract Polyimides have emerged as promising dielectric materials for communication equipment, owing to their excellent thermal stability and processability. Nonetheless, a pressing need remains to reduce the high-frequency dissipation factor ( D f ) of polyimides. Here, we synthesized various polyimides featuring linear backbone structures, finding that polyimides that incorporate a combination of ester groups and ether bonds exhibit low D f values of 0.0015-0.0024 at 10 GHz. Even in high humidity and temperature conditions they maintain low D f values of <0.005 at 10 GHz. To gain insight into the factors influencing this behavior, we conduct a comprehensive study involving aggregation structures and hygroscopic properties. Our findings highlight the pivotal role of high orientation and crystallinity in determining the high-frequency D f of polyimide films.
ISSN:2662-4443
2662-4443
DOI:10.1038/s43246-024-00502-7