Advanced thick film system for AlN substrates

Substrates with high thermal conductivity continue to be in great demand for their ability to enable smaller and denser high power circuits. BeO has been used for this purpose for many years with thick film materials. However, due to health and environmental concerns with BeO, many manufacturers fee...

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Published inMicroelectronics international Vol. 20; no. 1; pp. 48 - 51
Main Authors Wang, Y.L, Carroll, A.F, Smith, J.D, Cho, Y, Bacher, R.J, Anderson, D.K, Crumpton, J.C, Needes, C.R.S
Format Journal Article
LanguageEnglish
Published MCB UP Ltd 01.04.2003
Subjects
Substrates
Thick film
Thick film
Substrates
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Summary:Substrates with high thermal conductivity continue to be in great demand for their ability to enable smaller and denser high power circuits. BeO has been used for this purpose for many years with thick film materials. However, due to health and environmental concerns with BeO, many manufacturers feel compelled to switch to alternative substrates. This paper will discuss a thick film system consisting of conductors, dielectric, and resistors developed specifically for use with the most likely alternative, AlN substrates. This system will soon find broad use in applications such as power resistors for telecom, optoelectronic submounts, and high-power automotive applications.
Bibliography:href:13565360310455535.pdf
filenameID:2180200108
original-pdf:2180200108.pdf
istex:80F55824B53DC075F3EB834FD1E19708833420AD
ark:/67375/4W2-6F9D45N7-D
ObjectType-Article-2
SourceType-Scholarly Journals-1
ObjectType-Feature-1
content type line 23
ISSN:1356-5362
DOI:10.1108/13565360310455535