The application of Auger depth profiling to metal-semiconductor contacts
The past few years have seen the growth of a number of techniques capable of giving elemental distributions in thin film systems. This paper describes the application of one such technique—Auger depth profiling—to a range of metal-semiconductor contact problems. The aim of these studies was to deter...
Saved in:
| Published in | Thin solid films Vol. 57; no. 1; pp. 115 - 126 |
|---|---|
| Main Author | |
| Format | Journal Article |
| Language | English |
| Published |
Elsevier B.V
15.02.1979
|
| Online Access | Get full text |
Cover
Loading…
| Summary: | The past few years have seen the growth of a number of techniques capable of giving elemental distributions in thin film systems. This paper describes the application of one such technique—Auger depth profiling—to a range of metal-semiconductor contact problems.
The aim of these studies was to determine the extent to which metallurgical information can be correlated with the electrical properties of the device. The examples described are chosen to show the problems in interpretation of Auger data and the degree to which these data can elucidate the electrical properties. |
|---|---|
| Bibliography: | ObjectType-Article-2 SourceType-Scholarly Journals-1 ObjectType-Feature-1 content type line 23 |
| ISSN: | 0040-6090 1879-2731 |
| DOI: | 10.1016/0040-6090(79)90417-6 |