Millimeter-wave silicon MMIC interconnect and coupler using multilayer polyimide technology
This paper reports our latest progress in developing low-loss and low-crosstalk silicon MMIC interconnects for millimeter-wave applications. The proposed silicon/metal/polyimide (SIMPOL) structure based on multilayer polyimide technology is extremely effective in reducing noise crosstalk, and also p...
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Published in | IEEE transactions on microwave theory and techniques Vol. 48; no. 9; pp. 1482 - 1487 |
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Main Authors | , , , , , |
Format | Journal Article |
Language | English |
Published |
New York
IEEE
01.09.2000
The Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
Subjects | |
Online Access | Get full text |
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Summary: | This paper reports our latest progress in developing low-loss and low-crosstalk silicon MMIC interconnects for millimeter-wave applications. The proposed silicon/metal/polyimide (SIMPOL) structure based on multilayer polyimide technology is extremely effective in reducing noise crosstalk, and also provides very low line loss, even at the millimeter-wave regime. The measurement results of the developed SIMPOL structures demonstrate extremely low noise crosstalk (<-40 dB) in the entire frequency range (up to 50 GHz), which is limited by the dynamic range of the measurement equipment, and excellent insertion loss (<-0,25 dB/mm) up to 45 GHz. In addition, the SIMPOL concept is applied for the first time successfully in the design and fabrication of branch-line hybrids at millimeter-wave frequencies, 30 and 37 GHz. |
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Bibliography: | ObjectType-Article-2 SourceType-Scholarly Journals-1 ObjectType-Feature-1 content type line 23 |
ISSN: | 0018-9480 1557-9670 |
DOI: | 10.1109/22.868998 |