Microporosity in thin films

• Published in: Thin solid films Vol. 64; no. 1; pp. 149 - 161
• Main Author: Nakahara, S.
• Format: Journal Article
• Language: English
• Published: Elsevier B.V 15.11.1979
• ISSN: 0040-6090; 1879-2731
• DOI: 10.1016/0040-6090(79)90554-6

Because a large number of vacancies and voids can be incorporated into thin films during the deposition processes the films are generally porous. The presence of excess vacancies and voids greatly influences the physical properties. In particular freshly deposited films contain a large number (up to 1%) of excess vacancies which are highly mobile at ambient temperature. These excess vacancies are readily annihilated by diffusing to various sinks available in the thin films. During the annihilation process some film properties, which are sensitive to variations in the vacancy concentration, change continuously with time until all the excess vacancies are eliminated, leading to an aging phenomenon. In this report thin film microporosity is described in terms of the vacancies and voids incorporated during the deposition processes. The origins of these vacancies and voids and their effects on the physical properties of thin films are also discussed.