Room-temperature indentation creep of lead-free Sn-Bi solder alloys

• Published in: Journal of materials science. Materials in electronics Vol. 18; no. 10; pp. 1071 - 1078
• Main Authors: MAHMUDI, R, GERANMAYEH, A. R, MAHMOODI, S. R, KHALATBARI, A
• Format: Journal Article
• Language: English
• Published: Norwell, MA Springer 01.10.2007; Springer Nature B.V
• Subjects: Alloys; Applied sciences; Creep (materials); Creep strength; Electronics; Exact sciences and technology; Exponents; Grain boundaries; Indentation; Materials; Materials science; Tin base alloys; Hardening; Deformation; Creep; Tin alloy; Bismuth; Solder metal; Wrought alloy; Creep strength; Indentation; Room temperature; Cast alloy; Grain boundary
• ISSN: 0957-4522; 1573-482X
• DOI: 10.1007/s10854-007-9124-9

Creep behavior of the lead-free Sn-Bi alloys with bismuth contents in the range of 1-5 wt.% was studied by long time Vickers indentation testing at room temperature. The materials were examined in the homogenized cast and wrought conditions. The stress exponents, determined through different indentation methods, were in good agreement. The exponents of 13.4-15.3 and 9.2-10.0, found respectively for the cast and wrought conditions, are close to those determined by room-temperature conventional creep testing of the same material reported in the literature. Due to the solid solution hardening effects of Bi in Sn, creep rate decreased and creep resistance increased with increasing Bi content of the materials. Cast alloys, with a rather coarser grain structure and some Bi particles at the grain boundaries, showed typically higher resistance to indentation creep compared to the wrought materials. These two factors have apparently resulted in a less tendency of the material for grain boundary accommodated deformation, which is considered as a process to decrease the creep resistance of soft materials.[PUBLICATION ABSTRACT]