Wideband Analysis and Prolongation of Surrounding TGVs Shielding Structure in 3-D ICs

• Published in: IEEE microwave and wireless technology letters (Print) Vol. 33; no. 1; pp. 39 - 42
• Main Authors: Li, Wenlei, Zhang, Jihua, Gao, Libin, Chen, Hongwei, Fang, Zhen, Cai, Xingzhou, Li, Yong, Jia, Weicong, Guo, Huan
• Format: Journal Article
• Language: English
• Published: IEEE 01.01.2023
• Subjects: Analytical models; Crosstalk; crosstalk suppression; Equivalent circuits; Glass; Inductance; Integrated circuit modeling; shielding topology; three-dimensional integrated circuits (3-D ICs); through glass vias (TGVs); Topology
• ISSN: 2771-957X; 2771-9588
• DOI: 10.1109/LMWC.2022.3201523

Through glass vias (TGVs) with low substrate loss are subjected to signal distortion issues. This letter proposes a wideband scalable model for assessing signal reliability and rationalizing 3-D integrated design in glass interposers. The established equivalent circuit model is derived for extracting the parasitic parameters of the signal transmission unit, and the relevant variables stem from the geometric dimension parameters. The result of comparative analysis uncovers that the simulation results are in excellent accordance with the analytical model. Furthermore, seven crosstalk shielding topologies are proposed, and their noise suppression ability is analyzed. Such the shielding structures can not only reach the insertion loss (IL) performance below 0.15 dB but also achieve the crosstalk suppression capability exceeding 60 dB even at 40 GHz. Feasible strategies are proposed to trade off IL, noise isolation (NI), and occupied area in order to match suitable application scenarios, which can provide a reference for layout design.