Product-specific moisture levels: A conceptual framework

• Published in: IEEE transactions on device and materials reliability Vol. 3; no. 1; pp. 2 - 7
• Main Authors: Blish, R.C., Sidharth
• Format: Magazine Article
• Language: English
• Published: Piscataway, NJ IEEE 01.03.2003; Intitute of Electrical and Electronics Engineers; The Institute of Electrical and Electronics Engineers, Inc. (IEEE)
• Subjects: Absorption; Acceleration; Applied sciences; Building materials; Design. Technologies. Operation analysis. Testing; Devices; Discrimination; Electronics; Exact sciences and technology; Floors; Integrated circuits; Job shop scheduling; Moisture; Packages; Physics; Plastic packaging; Preconditioning; Schedules; Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices; Solvents; Stepped; Surface cracks; Surface-mount technology; Testing, measurement, noise and reliability; Humidity effect; Simulation; Ageing; Surface mount technology; Electronic packaging; Integrated circuit; Plastic packaging; Preconditioning
• ISSN: 1530-4388; 1558-2574
• DOI: 10.1109/TDMR.2003.808980

An improved schedule to evaluate surface-mount technology popcorn jeopardy based on physics of moisture absorption is proposed. Key features are: 1) each lettered level implies a certain performance irrespective of package thickness (i.e., no penalty for thinner packages); 2) each successive level has stepped moisture concentration at the interior (i.e., clear stepped discrimination between levels); and 3) the time required for preconditioning is substantially reduced from current practice and an acceleration factor can be clearly computed.