The electroplastic effect on the deformation and twinning behavior of AZ31 foils during micro-bending tests
•Miniature bending tests and ex-situ EBSD characterizations were employed to study the electroplastic effect of Mg alloy.•The electroplastic effect affects the Hall-Petch effect.•The electroplastic effect suppresses the activity of deformation twinning. Electric assisted (EA) plasticity is a promisi...
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Published in | Materials letters Vol. 288; p. 129362 |
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Main Authors | , , , |
Format | Journal Article |
Language | English |
Published |
Amsterdam
Elsevier B.V
01.04.2021
Elsevier BV |
Subjects | |
Online Access | Get full text |
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Summary: | •Miniature bending tests and ex-situ EBSD characterizations were employed to study the electroplastic effect of Mg alloy.•The electroplastic effect affects the Hall-Petch effect.•The electroplastic effect suppresses the activity of deformation twinning.
Electric assisted (EA) plasticity is a promising technology to improve the formability of hard-deformed materials like Mg alloys. Herein miniature three-point bending tests and ex-situ EBSD characterizations were executed to study the electroplastic effect (EPE) on the mechanical responses, deformation mechanisms, and microstructure evolution of Mg foils with different grain size and EA conditions. The EPE affects the material’s strength and invalidates the Hall-Petch effect. The ex-situ microstructure evolution tracking demonstrates the significant suppression of the EPE on deformation twinning; the EPE facilitates the activation of the non-basal slip to maintain the deformation compatibility. |
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ISSN: | 0167-577X 1873-4979 |
DOI: | 10.1016/j.matlet.2021.129362 |