Solution-processable thermally conductive polymer composite adhesives of benzyl-alcohol-modified boron nitride two-dimensional nanoplates

• Published in: Chemical engineering journal (Lausanne, Switzerland : 1996) Vol. 361; pp. 783 - 791
• Main Authors: Jung, Dae-Woong, Kim, Jun Min, Yoon, Hyun-Woo, Nam, Ki Min, Kwon, Yong-Eun, Jeong, Sooyeol, Baek, Young Hee, Choi, Yeon Suk, Chang, Sung-Jin, Yi, Gi-Ra, Cho, Jung Young, Lee, Gaehang
• Format: Journal Article
• Language: English
• Published: Elsevier B.V 01.04.2019
• Subjects: Benzyl alcohol; Boron nitride; Solvent recycling; Thermal conductivity; π-Stacking; Boron nitride; π-Stacking; Thermal conductivity; Solvent recycling; Benzyl alcohol
• ISSN: 1385-8947; 1873-3212
• DOI: 10.1016/j.cej.2018.12.128

[Display omitted] •Benzyl alcohol was introduced on a BN surface by π-stacking.•The high miscibility of B-BN with the epoxy improved κ of the composite.•The solvent could be recycled for the modification of BN without reduction in κ.•Solvent recycling can reduce the manufacturing cost. We prepared a high-concentration suspension of boron nitride (BN) nanoplates stabilized with benzyl alcohol (B-BN) in epoxy resin as a polymer composite adhesive for a highly efficient heat dissipation. At a BN concentration of 40 wt%, the polymer composite with B-BN exhibited a high thermal conductivity (κ = 1.51 W/m·K at 25 °C) comparable to that of a composite with bulk BN and significantly higher than that of a composite with a chemically modified BN (S-BN). Furthermore, the concentration of B-BN in the epoxy resin was increased to 46 wt% without a significant increase in viscosity, leading to a further improvement in the thermal conductivity to 2.11 W/m·K. The epoxy resin with B-BN exhibited a low coefficient of thermal expansion and high effective modulus owing to the strong affinity to the epoxy. Finally, we recycled benzyl alcohol more than 10 times for the preparation of B-BN, which may reduce the manufacturing cost and environmental pollution. Therefore, B-BN could be a promising filler for heat dissipation as well as starting material for additional modification.