UV/ozone treatment for adhesion improvement of copper/epoxy interface

[Display omitted] We developed a simple and efficient method for adhesion improvement of Cu/epoxy interface by utilizing UV/ozone treatment for surface oxidation of Cu substrates. X-ray photoelectron spectroscopy analysis revealed that metallic Cu surface was directly oxidized to CuO and Cu(OH)2 by...

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Bibliographic Details
Published inJournal of industrial and engineering chemistry (Seoul, Korea) Vol. 46; pp. 199 - 202
Main Authors Bok, Shingyu, Lim, Guh-Hwan, Lim, Byungkwon
Format Journal Article
LanguageEnglish
Published Elsevier B.V 25.02.2017
한국공업화학회
Subjects
Adhesion
Copper
Epoxy
Silane coupling agent
UV/ozone
화학공학
UV/ozone
Copper
Epoxy
Adhesion
Silane coupling agent
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Summary:[Display omitted] We developed a simple and efficient method for adhesion improvement of Cu/epoxy interface by utilizing UV/ozone treatment for surface oxidation of Cu substrates. X-ray photoelectron spectroscopy analysis revealed that metallic Cu surface was directly oxidized to CuO and Cu(OH)2 by UV/ozone treatment. The adhesion of a UV/ozone-treated and then silane-coated Cu substrate to a molded epoxy layer was greatly improved compared to that of a bare Cu substrate. Using this approach, we obtained the peel strength as high as 0.46kgf/cm from a low-roughness Cu substrate with Rq of ∼0.1μm.
Bibliography:G704-000711.2017.46..047
ISSN:1226-086X
1876-794X
DOI:10.1016/j.jiec.2016.10.031