Synthesis of isocyanurate‐based imidazole carboxylate as thermal latent curing accelerator for thermosetting epoxy resins

• Published in: Journal of applied polymer science Vol. 137; no. 40
• Main Authors: Sun, Xin, Wang, Yiming, Tang, Yuyao, Zhang, Bowen, Wei, Wei, Li, Xiaojie, Fei, Xiaoma, Liu, Xiaoya
• Format: Journal Article
• Language: English
• Published: Hoboken, USA John Wiley & Sons, Inc 20.10.2020; Wiley Subscription Services, Inc
• Subjects: Acid-base neutralization; Bisphenol A; Crosslinking; Curing; Electronic packaging; Epoxy compounds; Epoxy resins; Glass transition temperature; Heat resistance; Imidazole; Materials science; mechanical properties; Polymers; Resins; Room temperature; Shelf life; Storage modulus; thermal properties; Thermal resistance; Thermal stability; thermosets; viscosity and viscoelasticity
• ISSN: 0021-8995; 1097-4628
• DOI: 10.1002/app.49221

A novel thermal latent curing accelerator, 1‐(2‐cyanoethyl)‐2‐methylimidazole/tris (2‐carboxyethyl) isocyanurate adduct (2MICN‐T), was successfully synthesized through an acid–base neutralization of tris(2‐carboxyethyl)isocyanurate (TCEIC) and 1‐(2‐cyanoethyl)‐2‐methylimidazole (2MICN). It was further added into diglycidylether of bisphenol A based epoxy resin/methylhexahydrophthalic anhydride mixture to form one‐component curing systems. With the addition of 2 wt% of 2MICN‐T, the one‐component system could be steadily stored for more than 1 month at room temperature, while the shelf life of 2MICN curing system was only 2 days. Nonisothermal differential scanning calorimeter also demonstrated the excellent thermal latency of 2MICN‐T in low‐temperature region and rapid initiation of the curing reaction when raising temperature. Compared to the cured resins with original 2MICN as accelerator, the resulted thermosets exhibited enhanced glassy storage modulus, glass transition temperature, and thermal stability when 2 wt% of 2MICN‐T was applied. It was attributed to the chemical incorporation of the isocyanurate moieties with multi carboxyl groups and nitrogen‐contained heterocyclic ring, effectively increasing the crosslinking density, chain rigidity, and heat resistance of the cured resin. Thus, it is suggested that 2MICN‐T can play both roles as latent curing accelerator and modifier for one‐component epoxy compounds, and is particularly recommended for application in electronic packaging fields.