A passive micromachined device for alignment of arrays of single-mode fibers for hermetic photonic packaging-the CLASP concept

A micro-machined fiber alignment device, called the capture and locking alignment spring positioner (CLASP) has been fabricated. It uses a nickel leaf spring to passively capture vertical arrays of single-mode fibers with /spl sim/2 /spl mu/m accuracy.

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Bibliographic Details
Published inIEEE transactions on components, packaging, and manufacturing technology. Part B, Advanced packaging Vol. 19; no. 1; pp. 83 - 89
Main Authors Kravitz, S.H., Word, J.C., Bauer, T.M., Seigal, P.K., Armendariz, M.G.
Format Journal Article Conference Proceeding
LanguageEnglish
Published New York, NY IEEE 01.02.1996
Institute of Electrical and Electronics Engineers
Subjects
Alignment
Applied sciences
Arrayed waveguide gratings
Arrays
Circuit properties
Elastic moduli
Electric, optical and optoelectronic circuits
Electronics
Electronics packaging
Electroplating
Exact sciences and technology
Fabrication
Friction
Integrated optics. Optical fibers and wave guides
Micromachining
Nickel
Optical and optoelectronic circuits
Optical arrays
Optical devices
Optical fiber devices
Optical fibers
Optical surface waves
Optical waveguides
Packaging
Polyimides
Springs
Springs (components)
Substrates
Integrated optics
Array
Hermetic sealing
Single mode fiber
Leaf spring
Nickel
Package
Experimental study
Optical alignment
Optical fiber
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Summary:A micro-machined fiber alignment device, called the capture and locking alignment spring positioner (CLASP) has been fabricated. It uses a nickel leaf spring to passively capture vertical arrays of single-mode fibers with /spl sim/2 /spl mu/m accuracy.
Bibliography:ObjectType-Article-2
SourceType-Scholarly Journals-1
ObjectType-Feature-1
content type line 23
ISSN:1070-9894
1558-3686
DOI:10.1109/96.486489