Polycrystalline diamond pressure microsensor

• Published in: Diamond and related materials Vol. 5; no. 1; pp. 86 - 92
• Main Authors: Davidson, J.L., Wur, D.R., Kang, W.P., Kinser, D.L., Kerns, D.V.
• Format: Journal Article
• Language: English
• Published: Amsterdam Elsevier B.V 1996; Elsevier
• Subjects: Diamond; Exact sciences and technology; Instruments for strain, force and torque; Instruments, apparatus, components and techniques common to several branches of physics and astronomy; Mechanical instruments, equipment and techniques; Microelectromechanical; Microelectronic; Physics; Sensors; Diamond; Sensors; Microelectronic; Microelectromechanical; Thin films; Microelectronic fabrication; Piezoresistivity; Semiconductor materials; Piezoelectric materials; Microsensor; Diamonds; Polycrystals; Pressure measurement
• ISSN: 0925-9635; 1879-0062
• DOI: 10.1016/0925-9635(96)80010-0

Diamond deposition processing and silicon photolithographic and etching techniques were used to create undoped diamond diaphragms a few millimetres in diameter and 5–10 microns thick. Delineated and electrically isolated doped diamond resistors nominally 100 microns wide by 500 microns long by 4 microns thick, with thick film silver-based interconnect are fabricated on top of the diaphragm. Zero strain values of the resistors are nominally a few hundred kΩ Isolation ratio is greater than 10 3. As the membrane is flexed by pressure, the ΔR R piezoresistance (PZR) of the diamond resistors was measured. Various PZR configurations and temperature behaviour were examined.