High-power comparison among brazed, clamped and electroformed X-band cavities

We report the building procedure of X-band copper structures using the electroforming and electroplating techniques. These techniques allow the deposition of copper layers on a suitable die and they can be used to build RF structures avoiding the high temperature brazing step in the standard techniq...

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Published inNuclear instruments & methods in physics research. Section A, Accelerators, spectrometers, detectors and associated equipment Vol. 657; no. 1; pp. 88 - 93
Main Authors Spataro, B., Alesini, D., Chimenti, V., Dolgashev, V., Higashi, Y., Migliorati, M., Mostacci, A., Parodi, R., Tantawi, S.G., Yeremian, A.D.
Format Journal Article
LanguageEnglish
Published Elsevier B.V 21.11.2011
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Summary:We report the building procedure of X-band copper structures using the electroforming and electroplating techniques. These techniques allow the deposition of copper layers on a suitable die and they can be used to build RF structures avoiding the high temperature brazing step in the standard technique. We show the constructed prototypes and low power RF measurements and discuss the results of the high power tests at SLAC National Accelerator Laboratory.
Bibliography:ObjectType-Article-2
SourceType-Scholarly Journals-1
ObjectType-Feature-1
content type line 23
ISSN:0168-9002
1872-9576
DOI:10.1016/j.nima.2011.06.047