12-inch X-ray optics based on MEMS process

• Published in: Microsystem technologies : sensors, actuators, systems integration Vol. 23; no. 7; pp. 2815 - 2821
• Main Authors: Ishikawa, Kumi, Ezoe, Yuichiro, Numazawa, Masaki, Ogawa, Tomohiro, Sato, Mayu, Nakamura, Kasumi, Ohashi, Takaya, Mitsuda, Kazuhisa, Maeda, Ryutaro, Hiroshima, Hiroshi, Kurashima, Yuichi, Noda, Daiji
• Format: Journal Article
• Language: English
• Published: Berlin/Heidelberg Springer Berlin Heidelberg 01.07.2017
• Subjects: Electronics and Microelectronics; Engineering; Instrumentation; Mechanical Engineering; Nanotechnology; Technical Paper; Polishing Technique; Sidewall Surface; Slope Structure; Maskless Lithography; Chemical Mechanical Polishing
• ISSN: 0946-7076; 1432-1858
• DOI: 10.1007/s00542-016-2980-6

A large size X-ray optic with a 12-inch silicon wafer is fabricated to increase X-ray collecting power. The 12-inch silicon optic is formed by a combination of photolithography, dry etching and chemical mechanical polishing techniques. Furthermore, in order to smooth surfaces of the etched sidewalls used as X-ray reflection plane, the optic is annealed with high temperature. To verify the surface profile, X-ray reflectivity measurements are conducted with Al K α 1.49 keV and reflected X-rays are detected for the first time. From the X-ray reflectivity data, it is suggested that the optic has ridge and slope structures on the sidewall surfaces, which decrease the reflection region by shadowing a part of the sidewall surface and changing a practical incident angle. An estimated surface roughness is ∼ 2 nm rms, which is consistent with the surface profiles measured by an atomic force microscope.