Structural characterisation of self-implanted Si after HT-HP treatment

Recovery of damages in implanted silicon is still not fully understood. In this work, self-implanted silicon Si:Si is a model material. The implantation-damaged area in Si:Si is under high quasi-hydrostatic stress. Therefore, the application of external hydrostatic pressure (HP) at annealing of Si:S...

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Published inMaterials science & engineering. B, Solid-state materials for advanced technology Vol. 124; pp. 170 - 173
Main Authors Rzodkiewicz, W., Kudła, A., Misiuk, A., Surma, B., Bąk-Misiuk, J.
Format Journal Article
LanguageEnglish
Published Elsevier B.V 05.12.2005
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Summary:Recovery of damages in implanted silicon is still not fully understood. In this work, self-implanted silicon Si:Si is a model material. The implantation-damaged area in Si:Si is under high quasi-hydrostatic stress. Therefore, the application of external hydrostatic pressure (HP) at annealing of Si:Si samples gives possibility to obtain valuable information on the stress-related effects during out-annealing of structural damages. Czochralski grown single crystalline silicon (Cz-Si) samples were subjected to the implantation with Si + ions (silicon dose D = 5 × 10 16 cm −2) at 160 keV energy ( E). The Si:Si samples were treated at a high temperature (HT) up to 1130 °C under hydrostatic argon pressure up to 1.1 GPa for 5 h. Changes in the dielectric function ( ɛ) in both the as-implanted and HT-HP treated silicon samples have been determined. The considerable amelioration of both optical and structural properties of the self-implanted silicon samples for such treatment conditions like pressure, p = 1.1 Gpa; temperature, T = 800 °C; time, t = 5 h has been observed. For samples treated under 1.1 GPa and for 5 h, both real part ( ɛ 1) and imaginary part ( ɛ 2) of dielectric constant decreased with the increase of temperature in all spectral range. The agreement between results obtained by spectroscopic ellipsometry (SE) and other optical techniques has been found.
Bibliography:ObjectType-Article-2
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ISSN:0921-5107
1873-4944
DOI:10.1016/j.mseb.2005.08.027