A Ceramic Capacitor Substrate for High Speed Switching VLSI Chips

An integrated capacitor substrate which is proposed as an essential part in the realization of a thin film module for high speed digital computing systems is discussed. Several innovative multilayer ceramic (MLC) concepts relative to the fabrication of the desired low inductance capacitor and curren...

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Bibliographic Details
Published inIEEE transactions on components, hybrids, and manufacturing technology Vol. 5; no. 4; pp. 368 - 374
Main Authors Chance, D., Chung-Wen Ho, Bajorek, C., Sampogna, M.
Format Journal Article
LanguageEnglish
Published IEEE 01.12.1982
Subjects
Capacitors
Ceramics
Driver circuits
Fabrication
Inductance
Power supplies
Semiconductor device packaging
Substrates
Very large scale integration
Voltage
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Summary:An integrated capacitor substrate which is proposed as an essential part in the realization of a thin film module for high speed digital computing systems is discussed. Several innovative multilayer ceramic (MLC) concepts relative to the fabrication of the desired low inductance capacitor and current paths to chips are described. Ceramic and metal composite material sets which may be used in the fabrication are also proposed. Experimental evaluations of some of the crucial concepts were made and included in the discussions. The result is an elegant approach to the fabrication of one of the key requirements in realizing the thin film high performance module.
ISSN:0148-6411
1558-3082
DOI:10.1109/TCHMT.1982.1136005