A study of the oxidation behavior and the postannealing effect in a graded SiGe/Si heterostructure

A study on the dry thermal oxidation of a graded SiGe layer was performed. To reduce the Ge pileup effect during the thermal oxidation, the SiGe layer was deposited with much lower Ge content near the free surface than near the SiGe/Si heterointerface. After dry thermal oxidation at 900 degree C, th...

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Published inJournal of electronic materials Vol. 31; no. 5; pp. 529 - 534
Main Authors LIM, Y. S, JEONG, J. S, LEE, J. Y, KIM, H. S, SHON, H. K, KIM, H. K, MOON, D. W
Format Journal Article
LanguageEnglish
Published New York, NY Institute of Electrical and Electronics Engineers 01.05.2002
Springer Nature B.V
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Summary:A study on the dry thermal oxidation of a graded SiGe layer was performed. To reduce the Ge pileup effect during the thermal oxidation, the SiGe layer was deposited with much lower Ge content near the free surface than near the SiGe/Si heterointerface. After dry thermal oxidation at 900 degree C, the Ge composition in the pileup layer was significantly reduced and strain relaxation by defect formation was prevented due to the graded Ge distribution. To homogenize the Ge distribution between the pileup layer and remaining SiGe layer, the oxidized layers were postannealed. The homogenization is significantly enhanced by strain-induced diffusion, and it was confirmed by uphill diffusion of Ge. This result can propose an alternative oxidation method of strained SiGe /Si heterostructures.
Bibliography:ObjectType-Article-2
SourceType-Scholarly Journals-1
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content type line 23
ISSN:0361-5235
1543-186X
DOI:10.1007/s11664-002-0110-y