Synthesis and characterization of poly(aminobismaleimide)s obtained from solvent‐free mixtures

• Published in: Journal of applied polymer science Vol. 135; no. 16
• Main Authors: Soisson, Arnaud, Chikh, Linda, Banet, Philippe, Morelle, Jean‐Michel, Fichet, Odile
• Format: Journal Article
• Language: English
• Published: Hoboken Wiley Subscription Services, Inc 20.04.2018; Wiley
• Subjects: addition polymerization; Aliphatic compounds; Chemical Sciences; Chemical synthesis; Diamines; Encapsulation; Material chemistry; Materials science; molding; packaging; polyimides; Polymers; Solvents; Substitution reactions; Thermal expansion; Thermal stability; thermosets; Thermosetting resins
• ISSN: 0021-8995; 1097-4628
• DOI: 10.1002/app.46105

ABSTRACT A series of eight poly(aminobismaleimide)s containing aromatic units have been synthesized from a one‐step nucleophilic addition reaction between diamine and bismaleimide, without exogeneous solvent, to provide encapsulant withstanding high temperature suitable for power electronics. To have a homogeneous medium at room temperature, the solid aromatic diamines are first mixed with different liquid aliphatic ones, and then mixed with bismaleimide. The syntheses were then carried out at 175 °C for 15 min. Thus, according to their composition, these obtained thermosetting resins are characterized by a relaxation temperature between 98 and 190 °C and a coefficient of thermal expansion between 20 and 150 ppm/K. All material surfaces are hydrophobic and their moisture uptake is lower than 2–3 wt %. Finally, as expected, the substitution of a part of the aliphatic diamine by an aromatic one improves the thermal stability under air atmosphere of the resulting materials (Td = 280–300 °C increased to Td = 315–340 °C). Their use as power module encapsulant can therefore be considered. © 2018 Wiley Periodicals, Inc. J. Appl. Polym. Sci. 2018, 135, 46105.