Recrystallisation and bonding behaviour of ultra fine grained copper and Cu–Cr–Zr alloy using ECAP

• Published in: Materials science & engineering. A, Structural materials : properties, microstructure and processing Vol. 538; pp. 7 - 13
• Main Authors: Jayakumar, P.K., Balasubramanian, K., Rabindranath Tagore, G.
• Format: Journal Article
• Language: English
• Published: Kidlington Elsevier B.V 15.03.2012; Elsevier
• Subjects: Applied sciences; Cold working, work hardening; annealing, quenching, tempering, recovery, and recrystallization; textures; Cross-disciplinary physics: materials science; rheology; Cu–Cr–Zr alloy; Diffusion bonding; Electron microscopy; Equal channel angular processing; Exact sciences and technology; Hardness; Joining, thermal cutting: metallurgical aspects; Materials science; Mechanical properties and methods of testing. Rheology. Fracture mechanics. Tribology; Metals. Metallurgy; Microstructure; Other heat and thermomechanical treatments; Physics; Treatment of materials and its effects on microstructure and properties; Welding; Microstructure; Electron microscopy; Diffusion bonding; Equal channel angular processing; Cu–Cr–Zr alloy; Grain size; Thermal diffusion; High strain; Annealing; Electrical conductivity; Structure stability; Material processing; Mechanical properties; Plastic deformation; Hardness; ECAP; Thermal stability; Thermal properties; Cu-Cr-Zr alloy; Recrystallization; Fine grain structure; Copper; Grain refinement; Diffusion welding
• ISSN: 0921-5093; 1873-4936
• DOI: 10.1016/j.msea.2011.12.069

► Diffusion bonding behaviour of ECAPed Cu–Cr–Zr alloy and copper is investigated. ► Thermal stability of the materials is presented. ► Micostructural evolution of the two materials with ECAP is presented. The structure, thermal stability and diffusion bonding behaviour of oxygen free high conductivity copper (OFHC), and Cu–Cr–Zr alloy (CRZ) with ultra fine grains (UFG) produced by severe plastic deformation through equal-channel angular pressing (ECAP) are investigated. Microstructural study reveals a grain refinement from 150μm to 200nm sized grains after 8 ECAP passes. Thermal stability of ECAP processed OFHC and CRZ has been investigated. Both OFHC and CRZ show hardness reduction at temperatures above 100°C. However CRZ exhibits grain size stability up to a temperature of 500°C. Diffusion bonding studies reveal that bond strengths of ∼54MPa are developed between ECAP processed CRZ and OFHC at a lower temperature of 500°C when compared to annealed materials.