Forming solder joints by sintering eutectic tin-lead solder paste

It is possible to form solder joints with mechanical integrity, but not mechanical strength comparable to that achieved by melting the solder, by sintering eutectic tin-lead solder paste where small amounts of eutectic Sn-Bi powder are added to the paste. This increases the rate of sintering through...

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Bibliographic Details
Published inJournal of electronic materials Vol. 28; no. 7; pp. 912 - 915
Main Authors PALMER, M. A, ALEXANDER, C. N, NGUYEN, B
Format Journal Article
LanguageEnglish
Published New York, NY Institute of Electrical and Electronics Engineers 01.07.1999
Springer Nature B.V
Subjects
Applied sciences
Brazing. Soldering
Exact sciences and technology
Joining, thermal cutting: metallurgical aspects
Metals. Metallurgy
Lead alloy
Eutectic
Sintering
Soldered joint
Mechanical properties
Copper
Soldering
Brazing paste
Tin base alloys
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Summary:It is possible to form solder joints with mechanical integrity, but not mechanical strength comparable to that achieved by melting the solder, by sintering eutectic tin-lead solder paste where small amounts of eutectic Sn-Bi powder are added to the paste. This increases the rate of sintering through liquid-phase sintering.
Bibliography:ObjectType-Article-2
SourceType-Scholarly Journals-1
ObjectType-Feature-1
content type line 23
ISSN:0361-5235
1543-186X
DOI:10.1007/s11664-999-0219-3