Revealing the growth of copper on polystyrene- block -poly(ethylene oxide) diblock copolymer thin films with in situ GISAXS
Copper (Cu) as an excellent electrical conductor and the amphiphilic diblock copolymer polystyrene- block -poly(ethylene oxide) (PS- b -PEO) as a polymer electrolyte and ionic conductor can be combined with an active material in composite electrodes for polymer lithium-ion batteries (LIBs). As inter...
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Published in | Nanoscale Vol. 13; no. 23; pp. 10555 - 10565 |
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Main Authors | , , , , , , , , , , , , , , , |
Format | Journal Article |
Language | English |
Published |
Cambridge
Royal Society of Chemistry
21.06.2021
|
Subjects | |
Online Access | Get full text |
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Summary: | Copper (Cu) as an excellent electrical conductor and the amphiphilic diblock copolymer polystyrene-
block
-poly(ethylene oxide) (PS-
b
-PEO) as a polymer electrolyte and ionic conductor can be combined with an active material in composite electrodes for polymer lithium-ion batteries (LIBs). As interfaces are a key issue in LIBs, sputter deposition of Cu contacts on PS-
b
-PEO thin films with high PEO fraction is investigated with
in situ
grazing-incidence small-angle X-ray scattering (GISAXS) to follow the formation of the Cu layer in real-time. We observe a hierarchical morphology of Cu clusters building larger Cu agglomerates. Two characteristic distances corresponding to the PS-
b
-PEO microphase separation and the Cu clusters are determined. A selective agglomeration of Cu clusters on the PS domains explains the origin of the persisting hierarchical morphology of the Cu layer even after a complete surface coverage is reached. The spheroidal shape of the Cu clusters growing within the first few nanometers of sputter deposition causes a highly porous Cu–polymer interface. Four growth stages are distinguished corresponding to different kinetics of the cluster growth of Cu on PS-
b
-PEO thin films: (I) nucleation, (II) diffusion-driven growth, (III) adsorption-driven growth, and (IV) grain growth of Cu clusters. Percolation is reached at an effective Cu layer thickness of 5.75 nm. |
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Bibliography: | ObjectType-Article-1 SourceType-Scholarly Journals-1 ObjectType-Feature-2 content type line 23 |
ISSN: | 2040-3364 2040-3372 2040-3372 |
DOI: | 10.1039/d1nr01480c |