GaN-Based Metal-Insulator-Semiconductor High-Electron-Mobility Transistors Using Low-Pressure Chemical Vapor Deposition SiNx as Gate Dielectric
In this letter, silicon nitride (SiNx) film deposited at 780 °C by low-pressure chemical vapor deposition (LPCVD) was employed as gate dielectric for GaN-based metal-insulator-semiconductor high-electron-mobility transistors. The LPCVD-SiN x exhibit improved gate dielectric performance than the plas...
Saved in:
Published in | IEEE electron device letters Vol. 36; no. 5; pp. 448 - 450 |
---|---|
Main Authors | , , , , , , , , |
Format | Journal Article |
Language | English |
Published |
IEEE
01.05.2015
|
Subjects | |
Online Access | Get full text |
Cover
Loading…
Abstract | In this letter, silicon nitride (SiNx) film deposited at 780 °C by low-pressure chemical vapor deposition (LPCVD) was employed as gate dielectric for GaN-based metal-insulator-semiconductor high-electron-mobility transistors. The LPCVD-SiN x exhibit improved gate dielectric performance than the plasma enhanced chemical vapor deposition-SiN x , including smaller forward and reverse gate leakage, and higher forward gate breakdown voltage. |
---|---|
AbstractList | In this letter, silicon nitride (SiNx) film deposited at 780 °C by low-pressure chemical vapor deposition (LPCVD) was employed as gate dielectric for GaN-based metal-insulator-semiconductor high-electron-mobility transistors. The LPCVD-SiN x exhibit improved gate dielectric performance than the plasma enhanced chemical vapor deposition-SiN x , including smaller forward and reverse gate leakage, and higher forward gate breakdown voltage. |
Author | Zhihua Dong Shenghou Liu Mengyuan Hua Yong Cai Chen, Kevin J. Baoshun Zhang Cheng Liu Shu Yang Kai Fu |
Author_xml | – sequence: 1 surname: Mengyuan Hua fullname: Mengyuan Hua email: mhua@ust.hk organization: Dept. of Electron. & Comput. Eng., Hong Kong Univ., Hong Kong, China – sequence: 2 surname: Cheng Liu fullname: Cheng Liu organization: Dept. of Electron. & Comput. Eng., Hong Kong Univ., Hong Kong, China – sequence: 3 surname: Shu Yang fullname: Shu Yang organization: Dept. of Electron. & Comput. Eng., Hong Kong Univ., Hong Kong, China – sequence: 4 surname: Shenghou Liu fullname: Shenghou Liu organization: Dept. of Electron. & Comput. Eng., Hong Kong Univ., Hong Kong, China – sequence: 5 surname: Kai Fu fullname: Kai Fu organization: Suzhou Inst. of Nano-Tech & Nano-Bionics, Suzhou, China – sequence: 6 surname: Zhihua Dong fullname: Zhihua Dong organization: Suzhou Inst. of Nano-Tech & Nano-Bionics, Suzhou, China – sequence: 7 surname: Yong Cai fullname: Yong Cai organization: Suzhou Inst. of Nano-Tech & Nano-Bionics, Suzhou, China – sequence: 8 surname: Baoshun Zhang fullname: Baoshun Zhang organization: Dept. of Electron. & Comput. Eng., Hong Kong Univ., Hong Kong, China – sequence: 9 givenname: Kevin J. surname: Chen fullname: Chen, Kevin J. email: eekjchen@ust.hk organization: Dept. of Electron. & Comput. Eng., Hong Kong Univ., Hong Kong, China |
BookMark | eNp9kM9OwzAMhyMEEhtwR-KSF8hw2iZtj7CNgTT-SDCulZe6ENQ1U5IJeApemQ4QBw6cLEv-fba_IdvtXEeMHUsYSQnl6Xw6GSUg1SjJoCzyYocNpFKFAKXTXTaAPJMilaD32TCEFwCZZXk2YB8zvBHnGKjm1xSxFVdd2LQYnRf3tLLGdfXG9B2_tE_PYtqSid514totbWvjO3_w2AUb-onAF8F2T3zuXsWdpxA2nvj4eQvBlj_iuodMaO2CjdZ1_N7evHEMfIaR-MTSF9maQ7bXYBvo6KcesMXF9GF8Kea3s6vx2VyYNCmjQGqKpC5rrQHqVOkEtTE5JAgaZJlAqbEpGlXnSqu8gDqTJm90iiorE0NymR4w-OYa70Lw1FRrb1fo3ysJ1VZo1QuttkKrH6F9RP-JGBtx-0z0aNv_giffQUtEv3tyUKq_PP0E-aeGvw |
CODEN | EDLEDZ |
CitedBy_id | crossref_primary_10_1016_j_apsusc_2022_153086 crossref_primary_10_3390_electronics12214435 crossref_primary_10_1016_j_micrna_2022_207316 crossref_primary_10_1088_1361_6641_ac71c0 crossref_primary_10_1088_1361_6463_ab1dc3 crossref_primary_10_3390_mi13091396 crossref_primary_10_1088_0268_1242_31_2_024001 crossref_primary_10_1016_j_apsusc_2020_148530 crossref_primary_10_1109_TED_2018_2850042 crossref_primary_10_1088_2053_1591_4_2_025902 crossref_primary_10_1116_1_4944662 crossref_primary_10_1088_0268_1242_31_3_035005 crossref_primary_10_1039_D3TC00475A crossref_primary_10_7567_1882_0786_ab0139 crossref_primary_10_1016_j_spmi_2017_12_051 crossref_primary_10_1016_j_vacuum_2021_110359 crossref_primary_10_1109_TED_2018_2874314 crossref_primary_10_1109_TED_2015_2510445 crossref_primary_10_1088_0268_1242_31_6_065014 crossref_primary_10_1063_5_0194688 crossref_primary_10_1109_JEDS_2018_2869776 crossref_primary_10_1088_1361_6641_ab00c7 crossref_primary_10_1109_LED_2016_2636136 crossref_primary_10_3390_mi14112104 crossref_primary_10_35848_1347_4065_ac711d crossref_primary_10_1016_j_diamond_2020_108010 crossref_primary_10_1002_pssa_201700641 crossref_primary_10_1016_j_mssp_2021_105907 crossref_primary_10_1109_LED_2016_2519680 crossref_primary_10_1002_aelm_202001045 crossref_primary_10_1021_acsami_8b04694 crossref_primary_10_1016_j_microrel_2022_114568 crossref_primary_10_1088_1361_6641_ac5e00 crossref_primary_10_1109_LED_2015_2483760 crossref_primary_10_1109_LED_2020_3038808 crossref_primary_10_1109_TED_2017_2657579 crossref_primary_10_1109_TED_2019_2919246 crossref_primary_10_1109_TED_2020_3037888 crossref_primary_10_1007_s40094_019_00354_4 crossref_primary_10_1109_LED_2015_2465137 crossref_primary_10_1002_aenm_202001537 crossref_primary_10_1109_LED_2015_2489228 crossref_primary_10_1016_j_micrna_2023_207579 crossref_primary_10_3390_cryst12111581 crossref_primary_10_1088_1361_6463_abb161 crossref_primary_10_1002_pssa_201532395 crossref_primary_10_1088_1674_1056_abaed8 crossref_primary_10_1021_acsami_0c19483 crossref_primary_10_1109_TED_2019_2915837 crossref_primary_10_1116_1_5023844 crossref_primary_10_1109_TED_2018_2856998 crossref_primary_10_1088_1361_6463_ac87bb crossref_primary_10_1109_TED_2020_3029540 crossref_primary_10_1109_TED_2017_2657780 crossref_primary_10_1002_pssa_201532873 crossref_primary_10_1049_el_2018_1097 crossref_primary_10_1109_LED_2022_3149943 crossref_primary_10_1109_TED_2017_2789305 crossref_primary_10_1109_TED_2018_2869703 crossref_primary_10_1109_ACCESS_2020_2995906 crossref_primary_10_1515_nanoph_2020_0231 crossref_primary_10_7498_aps_66_197301 crossref_primary_10_1063_5_0217630 crossref_primary_10_1109_TED_2015_2469716 crossref_primary_10_1063_5_0179376 crossref_primary_10_1088_1674_1056_ab8895 crossref_primary_10_7567_JJAP_55_05FH01 crossref_primary_10_1002_pssa_202200509 crossref_primary_10_1109_TED_2016_2618421 crossref_primary_10_1063_1_5042809 crossref_primary_10_1016_j_apsusc_2022_154937 crossref_primary_10_1109_TED_2015_2510630 crossref_primary_10_3390_en16072978 crossref_primary_10_1063_1_4985592 crossref_primary_10_1088_1674_1056_abccba |
Cites_doi | 10.1088/0960-1317/6/1/001 10.1109/LED.2012.2185921 10.1063/1.1710030 10.1109/LED.2013.2279846 10.1109/LED.2012.2188016 10.1002/pssa.201000631 10.1016/S0022-0248(01)00617-0 10.1109/LED.2013.2286090 10.1109/LED.2013.2279844 10.1109/LED.2014.2322379 10.1109/IPEC.2010.5542030 |
ContentType | Journal Article |
DBID | 97E RIA RIE AAYXX CITATION |
DOI | 10.1109/LED.2015.2409878 |
DatabaseName | IEEE All-Society Periodicals Package (ASPP) 2005–Present IEEE All-Society Periodicals Package (ASPP) 1998–Present IEEE Electronic Library (IEL) CrossRef |
DatabaseTitle | CrossRef |
DatabaseTitleList | |
Database_xml | – sequence: 1 dbid: RIE name: IEEE Electronic Library (IEL) url: https://proxy.k.utb.cz/login?url=https://ieeexplore.ieee.org/ sourceTypes: Publisher |
DeliveryMethod | fulltext_linktorsrc |
Discipline | Engineering |
EISSN | 1558-0563 |
EndPage | 450 |
ExternalDocumentID | 10_1109_LED_2015_2409878 7055356 |
Genre | orig-research |
GrantInformation_xml | – fundername: Research Grants Council, University Grants Committee, Hong Kong grantid: N_HKUST636/13 funderid: 10.13039/501100002920 – fundername: Innovation and Technology Commmission grantid: ITS/192/14FP funderid: 10.13039/501100003452 |
GroupedDBID | -~X .DC 0R~ 29I 4.4 5GY 5VS 6IK 97E AAJGR AARMG AASAJ AAWTH ABAZT ABQJQ ABVLG ACGFO ACIWK ACNCT AENEX AETIX AFFNX AGQYO AGSQL AHBIQ AI. AIBXA AKJIK AKQYR ALLEH ALMA_UNASSIGNED_HOLDINGS ATWAV BEFXN BFFAM BGNUA BKEBE BPEOZ CS3 DU5 EBS EJD HZ~ IBMZZ ICLAB IFIPE IFJZH IPLJI JAVBF LAI M43 O9- OCL P2P RIA RIE RNS TAE TN5 TWZ VH1 AAYXX CITATION RIG |
ID | FETCH-LOGICAL-c329t-aef82d9d6600d3562a6cc702a060192096af8f5d7565780d41c7f63a5492ce1b3 |
IEDL.DBID | RIE |
ISSN | 0741-3106 |
IngestDate | Thu Apr 24 23:10:17 EDT 2025 Tue Jul 01 02:39:16 EDT 2025 Tue Aug 26 16:37:18 EDT 2025 |
IsPeerReviewed | true |
IsScholarly | true |
Issue | 5 |
Keywords | LPCVD silicon nitride MIS-HEMT Gallium nitride gate dielectric |
Language | English |
License | https://ieeexplore.ieee.org/Xplorehelp/downloads/license-information/IEEE.html |
LinkModel | DirectLink |
MergedId | FETCHMERGED-LOGICAL-c329t-aef82d9d6600d3562a6cc702a060192096af8f5d7565780d41c7f63a5492ce1b3 |
ORCID | 0000-0003-3016-1588 |
PageCount | 3 |
ParticipantIDs | ieee_primary_7055356 crossref_citationtrail_10_1109_LED_2015_2409878 crossref_primary_10_1109_LED_2015_2409878 |
ProviderPackageCode | CITATION AAYXX |
PublicationCentury | 2000 |
PublicationDate | 2015-May 2015-5-00 |
PublicationDateYYYYMMDD | 2015-05-01 |
PublicationDate_xml | – month: 05 year: 2015 text: 2015-May |
PublicationDecade | 2010 |
PublicationTitle | IEEE electron device letters |
PublicationTitleAbbrev | LED |
PublicationYear | 2015 |
Publisher | IEEE |
Publisher_xml | – name: IEEE |
References | ref13 moens (ref6) 2014 ref11 ref10 ref2 ref1 yang (ref12) 2014 ref8 ref7 ref9 ref4 ref3 ref5 |
References_xml | – ident: ref7 doi: 10.1088/0960-1317/6/1/001 – ident: ref11 doi: 10.1109/LED.2012.2185921 – start-page: 153 year: 2014 ident: ref12 article-title: Mapping of interface traps in high-performance Al2O3/AlGaN/GaN MIS-heterostructures using frequency- and temperature-dependent C-V techniques publication-title: Proc IEEE IEDM – ident: ref13 doi: 10.1063/1.1710030 – ident: ref4 doi: 10.1109/LED.2013.2279846 – ident: ref3 doi: 10.1109/LED.2012.2188016 – ident: ref2 doi: 10.1002/pssa.201000631 – ident: ref10 doi: 10.1016/S0022-0248(01)00617-0 – ident: ref5 doi: 10.1109/LED.2013.2286090 – start-page: 374 year: 2014 ident: ref6 article-title: An industrial process for 650 V rated GaN-on-Si power devices using in-situ SiN as a gate dielectric publication-title: Proc IEEE 26th Int Symp Power Semiconductor Devices ICs – ident: ref8 doi: 10.1109/LED.2013.2279844 – ident: ref9 doi: 10.1109/LED.2014.2322379 – ident: ref1 doi: 10.1109/IPEC.2010.5542030 |
SSID | ssj0014474 |
Score | 2.449106 |
Snippet | In this letter, silicon nitride (SiNx) film deposited at 780 °C by low-pressure chemical vapor deposition (LPCVD) was employed as gate dielectric for GaN-based... |
SourceID | crossref ieee |
SourceType | Enrichment Source Index Database Publisher |
StartPage | 448 |
SubjectTerms | Aluminum gallium nitride Dielectrics Gallium nitride Leakage currents Logic gates Silicon nitride |
Title | GaN-Based Metal-Insulator-Semiconductor High-Electron-Mobility Transistors Using Low-Pressure Chemical Vapor Deposition SiNx as Gate Dielectric |
URI | https://ieeexplore.ieee.org/document/7055356 |
Volume | 36 |
hasFullText | 1 |
inHoldings | 1 |
isFullTextHit | |
isPrint | |
link | http://utb.summon.serialssolutions.com/2.0.0/link/0/eLvHCXMwjV3JTsMwELVKT3BgR5RNPnBBwm3iOIuPQFsWtb2wiFvkeJEqUIO6iOUn-GU8ThoVhBC3JLIlR2N55nnevEHomEcsSwwFPTyLTZhnQpLFXBBPamV8oyT1oXa4P4iu7tnNY_hYQ6dVLYzW2pHPdBMeXS5f5XIGV2UtUH4JwmgJLVngVtRqVRkDxgrFZesh7bniVSlJj7d6nTZwuMKm9V4WYiffXNBCTxXnUrprqD9fTMEkeWrOpllTfvzQafzvatfRahlb4rNiM2ygmh5topUFxcEt9HkpBuTcei6F-9rG3eQauOgAvMkt0OTzEei_5mMM_A_SKXvkkH7uOLTv2Lk2pywywY5tgHv5KylqDMcaz-UH8IOwcT1u6zknDN8OB29YTDDc1uH2sOi-M5Tb6L7bubu4ImVPBiIDyqdEaJNQxVVkAyVl_46KSMrYowJ0XTi1gEiYxIQqhnRq4inmy9hEgQAhOKn9LNhB9VE-0rsIs9iTgkcqYJKzIDOca21sgGqob1-obqDW3EypLAXLoW_Gc-qAi8dTa9gUDJuWhm2gk2rGSyHW8cfYLTBZNa601t7vn_fRMkwumI4HqD4dz_ShjUam2ZHbhl8jJd0X |
linkProvider | IEEE |
linkToHtml | http://utb.summon.serialssolutions.com/2.0.0/link/0/eLvHCXMwjV1LT9wwEB4BPUAPpbzUbSn4wAUJ7yaO8_Cx7S4ssNkLD3GLHD-kVatNteyqjz_Rv1yPk40AIcQtiZzI1lj5ZjzffANwJBJeZpahHp6LTXhgY1qmQtJAGW1DqxULsXY4HyfDG35xF9-twElbC2OM8eQz08VLn8vXlVrgUVkPlV-iOFmFNw7347Cu1mpzBpzXmssOI92fJWiTkoHojQZ9ZHHFXYdfLsjOHoHQg64qHlRONyFfTqfmknzvLuZlV_19otT42vm-h3eNd0m-1NthC1bMdBvePtAc3IF_Z3JMvzrs0iQ3zvOm58hGx9CbXiFRvpqiAmw1I8gAoYOmSw7NK8-i_UM8uHltkXvi-QZkVP2idZXhzJClAAG5lc6zJ32zZIWRq8n4N5H3BM_rSH9S99-ZqF24OR1cfxvSpisDVRETcyqNzZgWOnGuknarYzJRKg2YRGUXwVxIJG1mY51iQjULNA9VapNIohScMmEZ7cHatJqaD0B4GigpEh1xJXhUWiGMsc5FtSx0N8x0oLc0U6EayXLsnPGj8KFLIApn2AINWzSG7cBx-8bPWq7jhbE7aLJ2XGOtj88_PoT14XU-Kkbn48tPsIEfqnmP-7A2ny3MZ-ebzMsDvyX_A9KV4GA |
openUrl | ctx_ver=Z39.88-2004&ctx_enc=info%3Aofi%2Fenc%3AUTF-8&rfr_id=info%3Asid%2Fsummon.serialssolutions.com&rft_val_fmt=info%3Aofi%2Ffmt%3Akev%3Amtx%3Ajournal&rft.genre=article&rft.atitle=GaN-Based+Metal-Insulator-Semiconductor+High-Electron-Mobility+Transistors+Using+Low-Pressure+Chemical+Vapor+Deposition+SiNx+as+Gate+Dielectric&rft.jtitle=IEEE+electron+device+letters&rft.au=Mengyuan+Hua&rft.au=Cheng+Liu&rft.au=Shu+Yang&rft.au=Shenghou+Liu&rft.date=2015-05-01&rft.pub=IEEE&rft.issn=0741-3106&rft.volume=36&rft.issue=5&rft.spage=448&rft.epage=450&rft_id=info:doi/10.1109%2FLED.2015.2409878&rft.externalDocID=7055356 |
thumbnail_l | http://covers-cdn.summon.serialssolutions.com/index.aspx?isbn=/lc.gif&issn=0741-3106&client=summon |
thumbnail_m | http://covers-cdn.summon.serialssolutions.com/index.aspx?isbn=/mc.gif&issn=0741-3106&client=summon |
thumbnail_s | http://covers-cdn.summon.serialssolutions.com/index.aspx?isbn=/sc.gif&issn=0741-3106&client=summon |