THz quantum cascade lasers with wafer bonded active regions

We demonstrate terahertz quantum-cascade lasers with a 30 μm thick double-metal waveguide, which are fabricated by stacking two 15 μm thick active regions using a wafer bonding process. By increasing the active region thickness more optical power is generated inside the cavity, the waveguide losses...

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Bibliographic Details
Published inOptics express Vol. 20; no. 21; pp. 23832 - 23837
Main Authors Brandstetter, M, Deutsch, C, Benz, A, Cole, G D, Detz, H, Andrews, A M, Schrenk, W, Strasser, G, Unterrainer, K
Format Journal Article
LanguageEnglish
Published United States 08.10.2012
Subjects
Equipment Design
Equipment Failure Analysis
Lasers
Quantum Theory
Refractometry - instrumentation
Terahertz Radiation
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Summary:We demonstrate terahertz quantum-cascade lasers with a 30 μm thick double-metal waveguide, which are fabricated by stacking two 15 μm thick active regions using a wafer bonding process. By increasing the active region thickness more optical power is generated inside the cavity, the waveguide losses are decreased and the far-field is improved due to a larger facet aperture. In this way the output power is increased by significantly more than a factor of 2 without reducing the maximum operating temperature and without increasing the threshold current.
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ISSN:1094-4087
1094-4087
DOI:10.1364/OE.20.023832