Reliability of composite solder bumps produced by an in-situ process

In an attempt to develop a thermally stable solder system, an in-situ Pb-Sn solder composite reinforced with Cu sub(6)Sn sub(5) dispersoids was investigated for its thermal stability. The stability was evaluated mainly by measuring the growth rate of intermetallics at in-situ composite solder/BLM in...

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Bibliographic Details
Published inJournal of electronic materials Vol. 29; no. 10; pp. 1264 - 1269
Main Authors LEE, Jong-Hyun, DAEJIN PARK, MOON, Jong-Tae, LEE, Yong-Ho, DONG HYUK SHIN, KIM, Yong-Seog
Format Conference Proceeding Journal Article
LanguageEnglish
Published New York, NY Institute of Electrical and Electronics Engineers 01.10.2000
Springer Nature B.V
Subjects
Applied sciences
Electronics
Exact sciences and technology
Materials
Solder bump
Interconnection
Ageing
Soldered joint
Shear strength
Reliability
Composite material
Thermal stability
Reflow soldering
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Summary:In an attempt to develop a thermally stable solder system, an in-situ Pb-Sn solder composite reinforced with Cu sub(6)Sn sub(5) dispersoids was investigated for its thermal stability. The stability was evaluated mainly by measuring the growth rate of intermetallics at in-situ composite solder/BLM interface as a function of the number of reflow soldering cycles and aging time. The rates were compared with those of the eutectic Pb-Sn and Sn-Ag solders. After the thermal treatments, the solder joints were tested for their shear strengths. The results indicated that the in-situ composite solder has a higher shear strength and better thermal stability than the eutectic Pb-Sn solder.
Bibliography:ObjectType-Article-2
SourceType-Scholarly Journals-1
ObjectType-Feature-1
content type line 23
ISSN:0361-5235
1543-186X
DOI:10.1007/s11664-000-0022-7