On the crystal forms of NDI-C6: annealing and deposition procedures to access elusive polymorphs

NDI-C6 has been extensively studied for its semiconducting properties and its processability. It is known to have several polymorphs and a high thermal expansion. Here we report the full thermal characterization of NDI-C6 by combining differential scanning calorimetry, variable temperature X-ray pow...

Full description

Saved in:
Bibliographic Details
Published inFaraday discussions Vol. 235; pp. 490 - 507
Main Authors de Oliveira Martins, Inês, Marin, Francesco, Modena, Enrico, Maini, Lucia
Format Journal Article
LanguageEnglish
Published Cambridge Royal Society of Chemistry 14.07.2022
Subjects
Online AccessGet full text

Cover

Loading…
More Information
Summary:NDI-C6 has been extensively studied for its semiconducting properties and its processability. It is known to have several polymorphs and a high thermal expansion. Here we report the full thermal characterization of NDI-C6 by combining differential scanning calorimetry, variable temperature X-ray powder diffraction, and hot stage microscopy, which revealed two different thermal behaviours depending on the annealing process. The ranking of stability was determined by the temperature and energy involved in the transitions: Form α is stable from RT up to 175 °C, Form β is metastable at all temperatures, Form γ is stable in the range 175–178 °C, and Form δ in the range 178–207 °C followed by the melt at 207 °C. We determined the crystal structure of Form γ at 54 °C from powder. The analysis of the thermal expansion principal axis shows that Form α and Form γ possess negative thermal expansion ( X 1) and massive positive thermal expansion ( X 3) which are correlated to the thermal behaviour observed. We were able to isolate pure Form α, Form β, and Form γ in thin films and we found a new metastable form, called Form ε, by spin coating deposition of a toluene solution of NDI-C6 on Si/SiO 2 substrates.
Bibliography:ObjectType-Article-1
SourceType-Scholarly Journals-1
ObjectType-Feature-2
content type line 23
ISSN:1359-6640
1364-5498
DOI:10.1039/d1fd00100k