Resistive switching conducting filament electroformation with an electrothermal phase field method

A phase field method self-consistently coupled to continuum heat transport and charge conservation is used to simulate conducting filament dynamical evolution and nanostructure of electroformed resistive switching thin films. Our method does not require a pre-defined idealized conducting filament, a...

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Bibliographic Details
Published inApplied physics letters Vol. 123; no. 8
Main Authors Sevic, John F., Kobayashi, Nobuhiko P.
Format Journal Article
LanguageEnglish
Published Melville American Institute of Physics 21.08.2023
Subjects
Applied physics
Electroforming
Evolution
Heat transmission
Nanostructure
Switching
Thin films
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Summary:A phase field method self-consistently coupled to continuum heat transport and charge conservation is used to simulate conducting filament dynamical evolution and nanostructure of electroformed resistive switching thin films. Our method does not require a pre-defined idealized conducting filament, as previous methods do, instead treating its dynamical evolution as a stochastic diffuse interface problem subject to a variational principle. Our simulation results agree well with available experimental observations, correctly reproducing electroformed conducting filament nanostructure exhibited by a variety of resistive switching thin films.
Bibliography:ObjectType-Article-1
SourceType-Scholarly Journals-1
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content type line 14
ISSN:0003-6951
1077-3118
DOI:10.1063/5.0151532