Study on Microstructure and Mechanical Properties of Al-Mg-Si-Cu Aluminium Alloy with High Ductility

A new type of Al-Mg-Si-Cu aluminium alloy with high ductility was studied in the present work. The microstructure features and mechanical properties of this alloy were systematically characterized by scanning electron microscopy (SEM), electron back-scatter Diffraction (EBSD), high resolution transm...

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Bibliographic Details
Published inMATEC Web of Conferences Vol. 326; p. 3003
Main Authors Xue, Guanxia, Zhong, Gu, Lin, Shipeng, Li, Hu-Tian, Gui, Xinghui, Zhang, Lei
Format Journal Article Conference Proceeding
LanguageEnglish
Published Les Ulis EDP Sciences 2020
Subjects
al-mg-si-cu aluminum alloy
Aluminum base alloys
Copper
Dispersion
Dispersions
Ductility
Fatigue strength
Fatigue tests
Forging
Grain boundaries
high ductility
High resolution electron microscopy
Magnesium
Mechanical properties
mechanical property
Microscopy
Microstructure
Precipitates
Recrystallization
Silicon
Tensile strength
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Summary:A new type of Al-Mg-Si-Cu aluminium alloy with high ductility was studied in the present work. The microstructure features and mechanical properties of this alloy were systematically characterized by scanning electron microscopy (SEM), electron back-scatter Diffraction (EBSD), high resolution transmission electron microscopy (HRTEM) and tensile and fatigue test. The percentage of sub-grain boundary under forging and aging process reaches up to 72% which can be attributed to the suppression of recrystallization by the nano-sized AlMnCrSi dispersoids. The combination of mechanical properties of the new alloy product in aged state showed that the ductility keeps in the range of 15~18%, yield strength and tensile strength are 310MPa and 380MPa respectively, fatigue strength ranges from 130MPa to 135MPa. It presents more excellent properties than commercial 6061 alloy for the nano-sized AlMnCrSi dispersoids, initial-β” precipitates and high percentage of sub-grain boundary.
ISSN:2261-236X
2274-7214
2261-236X
DOI:10.1051/matecconf/202032603003