Fabrication of extremely thermal-stable GaN template on Mo substrate using double bonding and step annealing process

A new layer transfer technique which comprised double bonding and a step annealing process was utilized to transfer the GaN epilayer from a sapphire substrate to a Mo substrate. Combined with the application of the thermal-stable bonding medium, the resulting two-inch-diameter GaN template showed ex...

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Bibliographic Details
Published inJournal of semiconductors Vol. 37; no. 8; pp. 15 - 18
Main Author 汪青 刘扬 孙永健 童玉珍 张国义
Format Journal Article
LanguageEnglish
Published 01.08.2016
Subjects
制备
模板
热稳定性
电力电子器件
蓝宝石衬底
退火工艺
钼基体
键合
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Summary:A new layer transfer technique which comprised double bonding and a step annealing process was utilized to transfer the GaN epilayer from a sapphire substrate to a Mo substrate. Combined with the application of the thermal-stable bonding medium, the resulting two-inch-diameter GaN template showed extremely good stability under high temperature and low stress state. Moreover, no cracks and winkles were observed. The transferred GaN template was suitable for homogeneous epitaxial, thus could be used for the direct fabrication of vertical LED chips as well as power electron devices. It has been confirmed that the double bonding and step annealing technique together with the thermal-stable bonding layer could significantly improve the bonding strength and stress relief, finally enhancing the thermal stability of the transferred GaN template.
Bibliography:11-5781/TN
gallium nitride; Mo substrate; medium bonding; laser lift off; thermal stability; homogeneous epitaxial
A new layer transfer technique which comprised double bonding and a step annealing process was utilized to transfer the GaN epilayer from a sapphire substrate to a Mo substrate. Combined with the application of the thermal-stable bonding medium, the resulting two-inch-diameter GaN template showed extremely good stability under high temperature and low stress state. Moreover, no cracks and winkles were observed. The transferred GaN template was suitable for homogeneous epitaxial, thus could be used for the direct fabrication of vertical LED chips as well as power electron devices. It has been confirmed that the double bonding and step annealing technique together with the thermal-stable bonding layer could significantly improve the bonding strength and stress relief, finally enhancing the thermal stability of the transferred GaN template.
ISSN:1674-4926
DOI:10.1088/1674-4926/37/8/083001