Cu Planarization in Electrochemical Mechanical Planarization

The electrochemical mechanical planarization (Ecmp) process is a revolutionary planarization technology uniquely combining removal rate controlled by charge with superior planarization efficiency in the near no-shear regime. A planarization mechanism for Ecmp is proposed to explain the high planariz...

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Published inJournal of the Electrochemical Society Vol. 153; no. 6; pp. C377 - C381
Main Authors Liu, Feng Q, Du, Tianbao, Duboust, Alain, Tsai, Stan, Hsu, Wei-Yung
Format Journal Article
LanguageEnglish
Published 2006
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Summary:The electrochemical mechanical planarization (Ecmp) process is a revolutionary planarization technology uniquely combining removal rate controlled by charge with superior planarization efficiency in the near no-shear regime. A planarization mechanism for Ecmp is proposed to explain the high planarization efficiency. Meanwhile, the effects of applied voltage on removal rate and planarization efficiency are discussed. The electrical feature allows Ecmp to be a planarization process with removal rate independent of downforce, enabling a wide removal rate window and high planarization efficiency.
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SourceType-Scholarly Journals-1
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ISSN:0013-4651
DOI:10.1149/1.2186180