Carbon Onion Composites for EMC Applications

A novel lightweight onion-like carbon (OLC)-based polymer composite with high electromagnetic (EM) shielding properties is presented. OLC have been produced via the large-scale production technology based on the annealing of detonation nanodiamond under vacuum conditions (or in inert atmosphere). EM...

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Bibliographic Details
Published inIEEE transactions on electromagnetic compatibility Vol. 54; no. 1; pp. 6 - 16
Main Authors Kuzhir, P. P., Paddubskaya, A. G., Maksimenko, S. A., Kuznetsov, V. L., Moseenkov, S., Romanenko, A. I., Shenderova, O. A., Macutkevic, J., Valušis, Gintaras, Lambin, P.
Format Journal Article
LanguageEnglish
Published New York IEEE 01.02.2012
The Institute of Electrical and Electronics Engineers, Inc. (IEEE)
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Summary:A novel lightweight onion-like carbon (OLC)-based polymer composite with high electromagnetic (EM) shielding properties is presented. OLC have been produced via the large-scale production technology based on the annealing of detonation nanodiamond under vacuum conditions (or in inert atmosphere). EM shielding effectiveness has been tested in the frequency range of 26-37 GHz. The highest EM attenuation at 36.6 GHz reaching -34 dB was observed for polymethylmethacrylate films comprising 20 wt.% of OLC. The shielding effectiveness data collected for microwave frequencies were found to correlate well with the electrical resistivity measurements by four-probe method as well as conductivity measurements provided by the broadband dielectric spectroscopy (20 Hz-3 GHz). It was proved experimentally that OLC EM shielding capacity can be optimized by varying the nanoonion cluster size and nanodiamond annealing temperature so that effective EM coatings can be produced. Both the experimental observations and theoretical simulations demonstrate that even small (smaller than percolation threshold) additions of OLC particles to a polymer host can noticeably modify the composite response to EM radiation.
Bibliography:ObjectType-Article-2
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content type line 23
ISSN:0018-9375
1558-187X
DOI:10.1109/TEMC.2011.2173348