Effects of BOX thickness, silicon thickness, and backgate bias on SCE of ET-SOI MOSFETs

In this work, we investigate the effect of BOX (Buried OXide) and silicon thickness on the SCE (Short-Channel Effects) of ET-SOI (Extremely Thin Silicon-on-Insulator) MOSFETs. It is found that the minimum channel length Lmin is only moderately sensitive to the BOX thickness but strongly dependent on...

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Bibliographic Details
Published inMicroelectronic engineering Vol. 238; p. 111506
Main Authors Su, Elizabeth Mei-hua, Hong, David Chuyang, Cristoloveanu, Sorin, Taur, Yuan
Format Journal Article
LanguageEnglish
Published Amsterdam Elsevier B.V 01.02.2021
Elsevier BV
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Summary:In this work, we investigate the effect of BOX (Buried OXide) and silicon thickness on the SCE (Short-Channel Effects) of ET-SOI (Extremely Thin Silicon-on-Insulator) MOSFETs. It is found that the minimum channel length Lmin is only moderately sensitive to the BOX thickness but strongly dependent on the silicon thickness. For a given threshold voltage, the choice of gate work function in combination with the backgate bias also plays a role on Lmin. Reverse bias mitigates SCE while forward bias aggravates SCE. An empirical expression of Lmin in terms of silicon thickness is given. [Display omitted] •The effect of buried oxide and silicon thickness on the Short-Channel Effects of ET-SOI MOSFETs are investigated.•Thinner silicon thickness is much more beneficial to the reduction of Lmin than thinner BOX thickness.•For a given threshold voltage, the choice of gate work function and backgate bias play a role on Lmin.•Reverse bias mitigates SCE while forward bias aggravates SCE
ISSN:0167-9317
1873-5568
DOI:10.1016/j.mee.2021.111506